November 15, 2006 11:00 ET

ATDF's Advanced Test Mask Aids Fujimi Breakthrough in Cu CMP Processing

AUSTIN, TX -- (MARKET WIRE) -- November 15, 2006 -- ATDF, the global R&D foundry, is expanding availability of its 454AZ CoMPetitor™ (also marketed as the 888N CoMPetitor™) test mask after a key supplier reported using it to develop a breakthrough process for low-impact chemical-mechanical planarization (CMP) of semiconductor wafers.

The supplier, Fujimi Corporation, found that the 454AZ enabled in-depth performance studies of the effects of its chemical-mechanical polishing slurries on copper lines and tantalum-based structures. (Fujimi Corporation is the U.S. subsidiary of Fujimi Incorporated of Japan.)

Fujimi said its best performance was obtained using Fujimi slurry DCM-CX4 with ammonium persulfate oxidizer, a process that achieves extremely low topography during post-copper CMP. Less than 20 nm dishing on a 100 um copper line was consistently obtained even after lengthy over-polishing.

"All of the tested types of copper low-k integration schemes, including those for porous low-k, yielded equivalent or better electrical performance than the previous generation of CMP processes," said Paul LeFevre, CMP Business Development Manager for Fujimi. "It is believed that this type of slurry could enable robust and high performance process for the next generation of CMP."

Fujimi reported its high-level results in August, during the 11th International Symposium on Chemical Mechanical Planarization at Lake Placid, NY.

"The 454 CoMPetitor™ has been designed to help tool-makers and consumable suppliers stay on the leading edge of the semiconductor industry," said Dave Anderson, ATDF general manager. "It has the smallest feature sizes available on a CMP mask and is available for both 200 mm and 300 mm wafers." Fujimi utilized the 454AZ to compare its proprietary platform with a best-known method (BKM) approach.

The 454AZ is part of a suite of ATDF test products designed to help chip-makers and suppliers calibrate tools and test products for the 45 nm and 32 nm microchip generations. Other products in the ATDF suite include the ATDF NanoPattern™ test wafers for 200 mm; ATDF High-Konfidence™ high-k gate films for 200 mm and 300 mm; and ATDF NextGate™ deposition materials for metal gate electrodes.

About ATDF: ATDF, a wholly owned subsidiary of SEMATECH, is a leading technology R&D center where research meets manufacturing for semiconductor manufacturers, equipment and materials suppliers, and others. ATDF customers can confidentially test new designs, integration methodologies, and prototype systems while protecting their own intellectual property, and development partners can work closely with one another in a custom manufacturing environment. ATDF also develops baseline processes, accepted industry-wide, that bring new tools and materials to manufacturing faster, at lower cost. More information can be found at

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