SOURCE: Aprio Technologies, Inc.

August 28, 2006 08:00 ET

Aprio Contributes Technology to Si2's Design to Manufacturing Coalition

New Interface Will Provide the Litho Link Between Design and Manufacturing

SANTA CLARA, CA -- (MARKET WIRE) -- August 28, 2006 -- Aprio Technologies, Inc., one of the electronic design automation (EDA) industry's technology leaders in design-for-manufacturability (DFM) solutions, today announced it has signed an agreement with the Silicon Integration Initiative (Si2) to contribute lithography process modeling and simulation technology to its Design to Manufacturing Coalition (DTMC). The contribution will be used to drive a standards effort for an open data interface specification in the rapidly growing DFM market space.

For sub-100nm designs, lithography-induced variations have become a major contributor to IC performance and yield degradation. Thus, it has become critical to incorporate lithography process modeling and simulation across the entire design to manufacturing flow. However, since lithography is unique to the fab's target process, and the data required by each tool in the design flow may be different, an open lithography process interface is needed to ensure complete and accurate data is passed throughout the entire design flow.

By standardizing the interface between IC design creation/analysis tools and lithography modeling and simulation tools, better litho-aware solutions can be quickly added to the IC design and analysis flows. This is important because it allows developers to focus on simulation accuracy, robustness, and techniques for correction and repair, instead of the interfaces between tools.

Aprio's offering is proof that open standards are capable of accelerating delivery of solutions to the market. By using Si2's OpenAccess standard, Aprio™ was able to quickly establish robust interfaces with DFM partners Ponte and Pyxis. A set of DFM Views™ are produced by Aprio's Halo™-Quest, a highly accurate silicon image simulation and analysis tool. Pyxis and Ponte access these views via the OpenAccess interface to enable a new generation of silicon-aware design applications. (See related press announcement dated July 10, 2006: "Aprio's Halo-Quest Yields Highly Accurate Silicon Image Data.")

"Aprio has a well-developed interface that is the result of working with many EDA vendors," said Mike Gianfagna, president and chief executive officer of Aprio Technologies. "By opening up this interface to be part of an industry standard, Aprio believes it can accelerate the proliferation of DFM-aware tools, which will help the industry and the users. As a user of OpenAccess, we are pleased with Si2's efforts and believe that Si2 can also create the momentum necessary to develop a lithography interface standard for the industry."

"DTMC is chartered with developing a stronger interface between the EDA and manufacturing worlds," said Steve Schulz, president and CEO of Si2. "We applaud Aprio's foresight in collaborating on this standard. We believe Aprio's contribution to this standard will accelerate the efforts of DTMC members to deliver a working standard for use by the industry to overcome the DFM issues facing us as we move into sub-100nm processes."

About Aprio

Founded in 2003 and headquartered in Santa Clara, California, Aprio Technologies, Inc. is a leader in design-for-manufacturability (DFM) solutions that ensure successful design and fabrication of nanometer technology semiconductors. At the core of Aprio's offerings is its unique capability to provide correct and accurate information; to designers about manufacturing issues, and to manufacturing engineers about design intent. Aprio's products leverage this capability to help our customers create more reliable and better yielding semiconductors without the need for dramatic changes to their existing design or tapeout flows. For more information, visit Aprio's Web site at or call +1(408) 855-8088.

Contact Information

  • For more information, contact:

    Eva Kam
    Aprio Technologies, Inc.
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    Patrick Corcoran
    Cain Communications
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