SOURCE: Cascade Microtech

Cascade Microtech

August 18, 2010 19:35 ET

Cascade Microtech Welcomes Ellen Raim as Vice President of Human Resources

BEAVERTON, OR--(Marketwire - August 18, 2010) -  Cascade Microtech, Inc. (NASDAQ: CSCD), a leading global supplier of probe stations, engineering probes and RF probe cards, has appointed Ellen Raim to the position of vice president of human resources effective August 16, 2010.

"We are extremely pleased to have Ellen join our executive team," said Michael Burger, president and CEO of Cascade Microtech, Inc. "As we rapidly expand around the world, the ability to recruit and develop our talent on a global basis is key to our future. Ellen is a proven professional with over 22 years' experience with evolving organizations. We will leverage her expertise to recruit new talent and retain our highly skilled employee base to support our organizational growth as we execute our three-year strategic plans."

Most recently, Ms. Raim was a principal in the Coraggio Group focused on integrating business strategy, large scale change management and organizational development. Prior to this she held the position of vice president of human resources at Electro-Scientific Industries and director of talent acquisition at Intel. Ms. Raim has a B.A. in Economics from Brown University, an M.A. in Organizational Design from Seattle University and a J.D. from the University of Miami Law School.

About Cascade Microtech, Inc.
Cascade Microtech, Inc. (NASDAQ: CSCD) is a worldwide leader in the precise electrical and mechanical measurement and test of integrated circuits (ICs) and other small structures. For technology businesses and scientific institutions that need to evaluate small structures, Cascade Microtech delivers access to electrical data from wafers, integrated circuits (ICs), IC packages, circuit boards and modules, MEMS, 3D TSV, LED devices and more. Cascade Microtech's leading-edge semiconductor production test products include unique probe cards and test sockets that reduce manufacturing costs of high-speed and high-density semiconductor chips. For more information visit