DALSA Corporation

DALSA Corporation

February 19, 2010 08:23 ET

DALSA Showcases HV and MEMS Capabilities at APEC 2010

MEMS foundry and high voltage CMOS design capabilities on display at Booth 546 at the Applied Power Electronics Conference and Exposition (APEC) in Palm Springs, CA, February 21 - 25, 2010

PALM SPRINGS, CALIFORNIA--(Marketwire - Feb. 19, 2010) - APEC - DALSA Corporation (TSX:DSA), a world-leading semiconductor and MEMS foundry, will feature its latest advancements in MEMS and HV CMOS fabrication along with its innovative HV ASIC design capabilities at APEC in Palm Springs, CA, February 21 - 25 2010, booth #546. APEC is the premier event in applied power electronics focusing on the practical and applied aspects of the power electronics business.

DALSA's design and foundry showcase at APEC

  MEMS Foundry - DALSA is renowned for its extensive experience with advanced fabrication strategies such as stacking circuits to reduce package size or combining MEMS and CMOS wafers to integrate sense and actuation with logic circuits. DALSA delivers field-proven 3D and wafer level packaging technologies including through-silicon vias and a wide range of wafer bonding techniques.
  HV CMOS Fabrication - DALSA has a long history in high voltage circuits and we offer a variety of HV CMOS/DMOS processes to cover applications from MEMS actuation and control to power management. As always, DALSA's experience and exceptional process portfolio allows the flexibility to optimize for diverse applications.
  HV ASIC Design - Take advantage of DALSA's years of expertise combining HV and MEMS designs with a system level perspective and specialized Engineering Design Assistance (EDA) tools to turn your requirements into a custom, purpose-built solution with optimal, differentiating performance for true competitive advantage.
  Customer Interaction / Business Partnerships – With a technology portfolio as wide and flexible as DALSA's, with deliverables as varied as ours, excellence in planning, quality assurance, and customer interaction are not optional activities—they are fundamental business requirements. Only through the dedication of DALSA's engineers, technicians, and operators to exceptional project management, comprehensive resource planning, rigorous quality methodologies, and devoted customer communication has the company achieved its global reputation for success.
Where: APEC
Palm Springs Convention Center
Palm Springs, California, USA
Booth #546
When: February 21 – 25, 2010

About DALSA Semiconductor

Located in Bromont, Quebec, Canada, DALSA's award winning semiconductor wafer foundry has a proud history of innovation in specialties such as MEMS, CCDs, and high voltage CMOS. As a pure-play foundry, our goal is to deliver innovative foundry capabilities as a manufacturing partner to fabless and fab-lite semiconductor companies to help them succeed with their advanced MEMS or IC designs. Visit www.dalsa.com/semi/.

About DALSA Corporation

DALSA (TSX:DSA) is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees worldwide, headquartered in Waterloo, Ontario, Canada. Established in 1980, the company designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing semiconductor products and services. For more information, visit www.dalsa.com.

All trademarks are registered by their respective companies. DALSA reserves the right to make changes at anytime without notice.

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