SOURCE: International SEMATECH Manufacturing Initiative

September 25, 2006 11:00 ET

ISMI Symposium Promoting Industry Challenge to Create "Green Fabs"

AUSTIN, TX -- (MARKET WIRE) -- September 25, 2006 -- The Green Fab Challenge, a practical workshop exploring the economic, social, and ecological benefits of environmentally friendly semiconductor factories, will rank among highlights of the 3rd ISMI Symposium on Manufacturing Effectiveness Oct. 9-11 at the Hilton Austin Airport.

The environmental workshop, scheduled for 8:30-11.30 a.m., Oct. 11, is an example of Symposium innovations that also include first-time exhibits from prominent industry suppliers and technical briefings on 300 mm Prime and 450 mm wafer size transitions.

"'Green Fab' is more than a catch slogan -- it's a mega-trend that's pushing us to integrate tools, programming, manufacturing methods and processes, and human talent into a comprehensive environmental system," said James Beasley, meeting chair and ISMI environmental engineer. "The Green Fab Workshop will demonstrate the leadership of ISMI and its members in environmental affairs, which we believe will impose the necessity of change for every fab on our planet."

The session will include a roster of blue-ribbon speakers, including:

--  Catherine Greener, Managing Director of DOMANI Sustainability
    Consulting, LLC
--  Paul Westbrook, LEED AP and Sustainable Development Manager for Texas
    Instruments Worldwide Construction
--  Ted Reichelt, Principal Engineer, Intel Global Environmental Group
--  Allan D. Chasey, PhD and Associate Professor, Del E. Webb School of
    Construction, Arizona State University
The workshop will be followed by an ISMI member company session in which fab design and construction experts will review objectives and develop scope for ISMI's 2007 project to develop an industry-specific environmental performance system for Green Fab projects.

This year's Symposium will be keynoted by Michihiro Inoue, executive engineer of Matsushita Semiconductor Company, who will speak on "Advanced System-on-Chip Manufacturing in the Digital Consumer Electronics Era." Expanded interest in the Symposium also has led to a forum for approximately 30 suppliers to exhibit products for software, parts and equipment for factory equipment for automation, processing, metrology and control.

The Symposium also will include more than 70 concurrent and serial sessions on fab productivity, equipment productivity, manufacturing sustainability, statistical methods, simulation and modeling, yield and metrology, and environmental design, plus a robust set of poster sessions on topics augmenting meeting sessions. In addition, in-depth technical presentations by ISMI member companies will occur Oct. 11 during a detailed discussion on the industry's eventual transition to 450 mm wafers.

Registration and more information are available at

ISMI is a global alliance of the world's major semiconductor manufacturers, dedicated to reducing cost per wafer, and ultimately cost per die, through cooperative programs focused on manufacturing effectiveness. The consortium conducts programs in manufacturing infrastructure, methods, standards, and productivity, with the aim of reducing the costs of producing finished wafers and chips and driving solutions to major productivity challenges. ISMI is a wholly owned subsidiary of SEMATECH of Austin, TX. More information is available at

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