SOURCE: Inapac

October 16, 2007 13:24 ET

Inapac Announces New 32Mb Stacked DRAM Design

Ideal for Use in Cellular Handset, Mobile TV and Broadband Wireless Applications

SAN JOSE, CA--(Marketwire - October 16, 2007) - Inapac Technology, Inc., a leading provider of DRAM solutions optimized for system-in-package (SiP) and multi-chip-package (MCP) devices, today announced the addition of a new 32Mb (megabit) SDRAM design to its family of products. The new memory chip design is cost- and feature-optimized to meet the requirements of mobile wireless applications, including media and image processors, WiMAX basebands and digital TV demodulators. Inapac estimates that the total cost of incorporating the 32Mb DRAM die into a SiP/MCP solution will be less than $0.60 in volume production in 2008.

"This new 32Mb design makes it easier and more cost-efficient to create SiPs for a new generation of mobile handset applications," said Naresh Baliga, vice president of marketing for Inapac. "It is bond-pad compatible with our existing 32Mb design, offering our customers a seamless transition path to lower power and reduced cost."

The chip design is based on Inapac's proven, high-volume SiPFLOW™ platform, which incorporates a unique design-for-test (DFT) architecture and production methodology that enables SiP/MCP suppliers to minimize costs while achieving exceptional levels of production quality and reliability. With tens of millions of units produced to date using Inapac's platform, the company has consistently achieved industry-leading reliability rates of less than 100 dppm (defective parts per million).

Configuration, Availability

The new Inapac 32Mb SDRAM design is fully characterized for production on the ProMOS 0.12-micron manufacturing process, and can be used for SiP/MCP implementations in stacked (die-to-die or die-to-substrate) configurations in all typical SiP/MCP package types (BGA, QFP, etc.). Samples are available now, along with the full suite of Inapac's SiPFLOW platform deliverables.

About Inapac

Inapac Technology, Inc. is a leading provider of memory technology and services for SiP (system-in-package) and MCP (multi-chip-package) solutions. Inapac provides IP and services based on a DFT (design-for-test) production methodology to deliver reliable, cost-effective memories. Products based on the company's proven SiPFLOW™ platform are licensed to semiconductor companies to enhance the performance, quality and reliability of products in the cell phone, consumer audio/video, digital imaging, and storage markets.

Inapac is headquartered in San Jose, California, with additional offices in Boise, Idaho, and Hsin-chu, Taiwan. For more information, visit the company's website at www.inapac.com.

Contact Information

  • Contacts:
    Naresh Baliga
    Inapac Technology, Inc.
    Tel: 408-434-6530 x242
    Email Contact

    Joe Fowler
    FS Communications
    Tel: 650-691-1488
    Email Contact