SOURCE: Infineon Technologies North America Corp.

December 03, 2007 08:00 ET

Infineon Highlights Innovative Hybrid Electric Vehicle Power Modules at Electric Vehicle Symposium

ANAHEIM, CA--(Marketwire - December 3, 2007) - EVS 23, Booth #673 -- At the 23rd Electric Vehicle Symposium and Exposition (EVS 23) this week, Infineon Technologies AG (FRANKFURT: IFX) (NYSE: IFX) is showing innovative power electronics technologies that reduce the size and weight of the motor drive systems of hybrid electric vehicles (HEVs). Infineon semiconductor components and HybridPACK power modules, which have been selected for use in new HEVs by manufacturers around the world, are shown in a demonstrator electric cart and in static displays in the company's booth (#673).

In typical HEVs, the size and weight of power modules are key determinants of the electric motor drive system size and weight. The Infineon HybridPACK modules are dramatically smaller (as much as 25 percent) compared to other power modules providing the same output power, and they offer several performance advantages. Infineon uses its Trench Fieldstop™ IGBT and Emcon diode technologies to achieve industry-leading high current density. These devices are highly efficient and therefore convert more power for the same battery input power. Additionally, the devices can operate at 150degreeC maximum junction temperature, which eliminates the need for an additional coolant loop for HEVs. Finally, the Infineon modules combine innovative design practices, improved ceramic substrate and enhanced process technologies to achieve automotive reliability without using expensive base-plate material.

"Development of an optimal design for HEV power modules requires a unique combination of know-how in power semiconductors, electronic controls and automotive systems," said Christopher Cook, general manager of the Automotive, Industrial and Multimarket Business Group of Infineon Technologies North America Corp. "We've drawn on expertise in microcontrollers, sensors and power devices to produce very cost-effective solutions that will enable manufacturers to make HEVs available in a wider variety of automobile models and offer consumers more choices for energy-efficient transportation."


Infineon HybridPACK modules are available in different configurations for different types of applications, including micro-, mild- and full-hybrid vehicles. The modules, power components, microcontrollers and sensors shown at EVS 23 are now available to automotive manufacturers and component suppliers. For further information on the portfolio of Infineon products for HEVs and energy efficient transportation applications, please see:

About Infineon

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2007 fiscal year (ending September), the company reported sales of Euro 7.7 billion (including Qimonda sales of Euro 3.6 billion) with approximately 43,000 employees worldwide (including approximately 13,500 Qimonda employees). With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX).

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