SOURCE: NXP Semiconductors

NXP Semiconductors

April 19, 2010 09:07 ET

NXP Releases Industry's Largest Range of Automotive Qualified Power SO-8 MOSFETs in LFPAK

Introduces Highly Reliable, Q101 Qualified-Power MOSFETs in LFPAK for Automotive Applications

EINDHOVEN, NETHERLANDS and LONDON--(Marketwire - April 19, 2010) -  NXP Semiconductors today became the first supplier to launch a full range of automotive power MOSFETs housed in the compact, thermally enhanced Loss Free PAcKage (LFPAK). The new range of Q101 qualified LFPAK MOSFETs combines NXP's expertise in packaging technology and its experience in TrenchMOS technology to deliver what is believed to be the most reliable Power SO-8 package in the world. LFPAK is optimised for high-density automotive applications with a footprint 46%smaller than that of DPAK whilst offering similar thermal performance.

With an ever-increasing consumer demand for more electronic applications, automotive OEMs face the challenge of introducing new features within the vehicle's limited space, whilst trying to maintain fuel efficiency, electronic stability and reliability. LFPAK is NXP's innovative solution to the automotive requirement for a reliable, thermally enhanced power package with significantly reduced footprint size. The package design has been optimised to give the best thermal and electrical performance, cost and reliability to automotive OEMs. It overcomes the thermal limitations of SO8, enabling thermal resistance comparable to those of larger power packages such as DPAK.

The NXP LFPAK package uses a copper clip design to reduce the package resistance and inductance which in turn reduces the RDS(on) and switching losses of the MOSFET. LFPAK offers the designer a MOSFET with similar electrical and thermal performance to DPAK, with a footprint 46% smaller. This helps in designing a solution that is smaller than previously possible or to achieve up to 46% higher power density by adding new features to an existing design without increasing the module size or compromising on reliability. The full NXP range of LFPAKs allows designers to pick and choose devices according to application requirements, whilst enabling them to change their selection when module requirements change.

"We believe that NXP's LFPAK will set a new industry benchmark as the most reliable power MOSFET package in the automotive market. It will allow the development of more compact modules for the automotive OEMs," said Norman Stapelberg, Senior Product Marketing Manager, NXP Semiconductors. "Customer feedback consistently shows that LFPAK is more reliable than competitor QFN & micro-lead devices. The launch of LFPAK displays NXPs continued commitment to the development and manufacture of low voltage MOSFETs for the automotive industry," he added.

NXP's LFPAK range offer best-in-class performance and reliability across the 5 voltage grades compared to all fully automotive qualified Power SO-8 MOSFETs available in the market.

Key benefits

  • Low inductance
  • Low thermal resistance
  • Dimensions comparable to SO8
  • Significantly thinner than SO8 & DPAK
  • Wirebond free - Cu clip design
  • High current transient robustness
  • 100% avalanche tested
  • Automotive AEC-Q101 qualified to 175°C
  • Leads are optical-inspection friendly

Target applications

  • Engine and transmission controllers
  • Advanced Braking Systems
  • Coolant pumps
  • DC/DC converters
  • Electric power steering (EPS) and electric hydraulic power steering (EHPS) systems for cars.
  • Reverse battery protection
  • General-purpose automotive switching where space is at a premium

Design tools

  • Thermal Design guide
  • Spice models
  • Thermal models
  • Universal SO-8 footprint

Availability

Samples are currently available. Distribution samples for Europe, US and APAC will be available from July 2010. For more information please visit:
www.nxp.com/automotivemosfets
http://www.nxp.com/infocus/topics/high_reliability_automotive_mosfets/index.html

About NXP Semiconductors
NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. Headquartered in Europe, the company has about 27,000 employees working in more than 25 countries and posted sales of USD 3.8 billion in 2009.

Forward-looking Statements
This release may contain certain forward-looking statements with respect to the financial condition, results of operations and business of NXP and certain plans and objectives of NXP with respect to these items. By their nature, forward-looking statements involve risk and uncertainty because they relate to events and depend on circumstances that will occur in the future and there are many factors that could cause actual results and developments to differ materially from those expressed or implied by these forward-looking statements.

Contact Information

  • For further press information, please contact:
    USA:
    Rebecca Samuel
    Tel. +1 408 474 8769
    Email Contact

    Europe:
    Terry Chiang
    Tel. +31 40 2725162
    Email Contact

    APAC:
    Mark Chisholm
    Tel. +65 6882 5092
    Email Contact

    Greater China:
    Jannet Chen
    Tel. +86 21 2205 5883
    Email Contact

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