SOURCE: STATS ChipPAC

STATS ChipPAC

April 12, 2010 18:00 ET

STATS ChipPAC First to Implement 300mm Manufacturing for eWLB Technology

Transition to 300mm Reconstituted Wafers Increases Capacity and Provides Significant Cost Advantages to Customers

SINGAPORE -- 4/13/2010, UNITED STATES--(Marketwire - April 12, 2010) -  STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced that it has expanded the embedded Wafer-Level Ball Grid Array (eWLB) technology to reconstituted 300mm wafers. STATS ChipPAC is the first in the semiconductor industry to introduce 300mm eWLB wafer manufacturing capabilities.

STATS ChipPAC is firmly established as the leader in eWLB manufacturing volume, capacity and yields, with current quarterly shipments in excess of 30,000 reconstituted wafers and is on track to achieve yields of 99% and above by the end of 2010. By adding capacity through 300mm wafer manufacturing, STATS ChipPAC's customers can benefit from the cost and productivity advantages of eWLB technology on the larger 300mm reconstituted wafer format which provides higher efficiency and economies of scale as compared to the existing 200mm eWLB wafer format. STATS ChipPAC has invested more than US$100 million in eWLB technology. The introduction of 300mm eWLB wafer manufacturing demonstrates the Company's strong focus on leading edge integration technology.

The eWLB technology has already been proven and adopted by many major mobile handset manufacturers to meet the relentless market demand for complex and power efficient semiconductor devices within a continuously shrinking package footprint. STATS ChipPAC is committed to delivering the most cost effective eWLB packaging solution to the market. Through an exclusive alliance with its technology partners, Infineon Technologies AG and STMicroelectronics, STATS ChipPAC jointly developed and is the first in the semiconductor industry to manufacture innovative eWLB technology such as side by side devices embedded in a package, ultra thin eWLB package and two metal layer redistribution. At STATS ChipPAC, development work continues on the eWLB evolution to enable larger package sizes, higher Input/Output (I/O) density and 3D Package on Package (PoP) solutions to address a wider application market. 

"The 300mm eWLB wafer manufacturing accomplishment is a milestone for the industry and is the result of leveraging the strengths of STATS ChipPAC and its manufacturing partner, Infineon Technologies. Today, STATS ChipPAC is the world largest and leading volume manufacturer in eWLB and the continued growth of capacity and transition to 300mm wafer manufacturing will further position us to deliver a high performance solution at a lower cost point for our customers," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC. "We believe the exclusive relationship we have with our eWLB technology development partners ensures that STATS ChipPAC will continue to build a strong portfolio of advanced solutions for our customers."

Forward-Looking Statements
Certain statements in this release are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. These include statements such as on the future of the eWLB evolution. Factors that could cause actual results to differ include, but are not limited to, general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; possible future application of push-down accounting; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilization; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; shortages in supply of key components; customer credit risks; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; classification of our Company as a passive foreign investment company; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited ("Temasek") that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labor union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; the continued trading and listing of our ordinary shares on the Singapore Exchange Securities Trading Limited ("SGX-ST"); and other risks described from time to time in the Company's filings with the U.S. Securities and Exchange Commission, including its annual report on Form 20-F dated March 5, 2010. You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.

About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.

Contact Information

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