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STATS ChipPAC Ramps eWLB Technology to High Volume Production
Robust Manufacturing Process in Place to Support First Generation eWLB
| Source: STATS ChipPAC
SINGAPORE -- 11/30/2009, UNITED STATES--(Marketwire - November 30, 2009) - STATS ChipPAC Ltd.
("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading
semiconductor test and advanced packaging service provider, today announced
it has ramped first generation embedded Wafer-Level Ball Grid Array (eWLB)
technology to high volume production.
The eWLB technology provides solutions for semiconductor devices requiring
a higher integration level and a greater number of external contacts. Using
a combination of traditional 'front-end' and 'back-end' semiconductor
manufacturing techniques, eWLB technology greatly reduces manufacturing
costs while providing a smaller package footprint with higher Input/Output
(I/O) along with increased thermal and electrical performance.
STATS ChipPAC has established a robust, automated eWLB manufacturing
process that includes wafer reconstitution, wafer level molding,
redistribution using thin film technology, solder ball mount, package
singulation and testing. Incoming wafers in both 8" and 12" diameters can
be supported, and no bumping is required as the package is essentially
built on top of a reconstituted wafer.
"Backed by a strong infrastructure and cost effective manufacturing
process, we are able to deliver a high performance solution at a lower cost
point with volume and maturity, leveraging the potential of batch panel
processing of high density wafer fabrication redistribution technology,"
said Dr. Han Byung Joon, Executive Vice President and Chief Technology
Officer of STATS ChipPAC. "We successfully demonstrated the reliability of
first generation eWLB technology, ramped to volume production and are
positioned to double our production unit volume by the end of 2009."
Typical applications for eWLB are baseband and RF products for mobile and
consumer products. The next generation of eWLB packages enabling reduced
cost, multiple routing layers, multiple die, and expansion to larger
package size and ball count is now being developed with STATS ChipPAC's
development partners for product offerings starting in 2010.
Forward-Looking Statements
Certain statements in this release are forward-looking statements that
involve a number of risks and uncertainties that could cause actual events
or results to differ materially from those described in this release.
Factors that could cause actual results to differ include, but are not
limited to, deterioration in general business and economic conditions and
the state of the semiconductor industry; prevailing market conditions;
demand for end-use applications products such as communications equipment,
consumer and multi-applications and personal computers; decisions by
customers to discontinue outsourcing of test and packaging services; level
of competition; our reliance on a small group of principal customers; our
continued success in technological innovations; customer credit risks;
possible future application of push-down accounting; pricing pressures,
including declines in average selling prices; intellectual property rights
disputes and litigation; our ability to control operating expenses; our
substantial level of indebtedness and access to credit markets; our ability
to generate cash; potential impairment charges; availability of financing;
adverse tax and other financial consequences if the taxing authorities do
not agree with our interpretation of the applicable tax laws; our ability
to meet specific conditions imposed for the continued listing or delisting
of our ordinary shares on the Singapore Exchange Securities Trading Limited
(SGX-ST); classification of the Company as a passive foreign investment
company; our ability to develop and protect our intellectual property;
rescheduling or canceling of customer orders; changes in our product mix;
our capacity utilization; delays in acquiring or installing new equipment;
limitations imposed by our financing arrangements which may limit our
ability to maintain and grow our business; returns from research and
development investments; changes in customer order patterns; shortages in
supply of key components; disruption of our operations; loss of key
management or other personnel; defects or malfunctions in our testing
equipment or packages; changes in environmental laws and regulations;
exchange rate fluctuations; regulatory approvals for further investments in
our subsidiaries; majority ownership by Temasek Holdings (Private) Limited
("Temasek") that may result in conflicting interests with Temasek and our
affiliates; unsuccessful acquisitions and investments in other companies
and businesses; labor union problems in South Korea; uncertainties of
conducting business in China and changes in laws, currency policy and
political instability in other countries in Asia; natural calamities and
disasters, including outbreaks of epidemics and communicable diseases; and
other risks described from time to time in the Company's filings with the
U.S. Securities and Exchange Commission, including its annual report on
Form 20-F dated March 9, 2009. You should not unduly rely on such
statements. We do not intend, and do not assume any obligation, to update
any forward-looking statements to reflect subsequent events or
circumstances.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging
design, assembly, test and distribution solutions in diverse end market
applications including communications, digital consumer and computing. With
global headquarters in Singapore, STATS ChipPAC has design, research and
development, manufacturing or customer support offices in 10 different
countries. STATS ChipPAC is listed on the SGX-ST. Further information is
available at www.statschippac.com. Information contained in this website
does not constitute a part of this release.