UNITED STATES--(Marketwire - September 27, 2007) - SINGAPORE - 9/27/2007 - STATS ChipPAC Ltd.
("STATS ChipPAC" or the "Company") (
NASDAQ:
STTS) (SGX-ST: STATSChP), a
leading independent semiconductor test and advanced packaging service
provider, announced that the Company is scheduled to present at the
Deutsche Bank Leveraged Finance Conference on Thursday, October 4, 2007 in
Scottsdale, Arizona. Tham Kah Locke, Vice President of Corporate Finance,
will present at the conference. The slide presentation for this event will
be available on the Company's website at
www.statschippac.com.
Place: The Phoenician in Scottsdale, Arizona
Time: 3:30 p.m., Thursday, October 4, 2007 in Scottsdale
6:30 p.m., Thursday, October 4, 2007 in New York
6:30 a.m., Friday, October 5, 2007 in Singapore
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (
NASDAQ:
STTS)
(SGX-ST: STATSChP) is a leading service provider of semiconductor packaging
design, assembly, test and distribution solutions. A trusted partner and
supplier to leading semiconductor companies worldwide, STATS ChipPAC
provides fully integrated, multi-site, end-to-end packaging and testing
solutions that bring products to the market faster. Our customers are some
of the largest wafer foundries, integrated device manufacturers (IDMs) and
fabless companies in the United States, Europe and Asia. STATS ChipPAC is a
leader in mixed signal testing and advanced packaging technology for
semiconductors used in diverse end market applications including
communications, power, digital consumer and computing. With advanced
process technology capabilities and a global manufacturing presence
spanning Singapore, South Korea, China, Malaysia and Taiwan, STATS ChipPAC
has a reputation for providing dependable, high quality test and packaging
solutions. The Company's customer support offices are centered in the
United States (California's Silicon Valley, Arizona, Texas, Massachusetts,
Colorado and North Carolina). Our offices outside the United States are
located in South Korea, Singapore, China, Malaysia, Taiwan, Japan, the
Netherlands and United Kingdom. STATS ChipPAC's facilities include those
of its subsidiary, Winstek Semiconductor Corporation, in Hsinchu District,
Taiwan. These facilities offer new product introduction support,
pre-production wafer sort, final test, packaging and other high volume
preparatory services. Together with our research and development centers in
South Korea, Singapore, Malaysia, China, Taiwan and the United States as
well as test facilities in the United States, this forms a global network
providing dedicated test engineering development and product engineering
support for customers from design to volume production. STATS ChipPAC is
listed on both the Nasdaq Stock Market (NASDAQ) and the Singapore Exchange
Securities Trading Limited (SGX-ST). In addition, STATS ChipPAC is also
included in the Morgan Stanley Capital International (MSCI) Index. Further
information is available at
www.statschippac.com. Information contained in
this website does not constitute a part of this release.
Contact Information: Investor Relations Contact:
Tham Kah Locke
Vice President of Corporate Finance
Tel: (65) 6824 7788
Fax: (65) 6720 7826
email:
Media Contact:
Lisa Lavin
Senior Marcom Manager
Tel: (208) 939 3104
Fax: (208) 939 4817
email: