STATS ChipPAC's Copper Wire Bond Offering in Volume Production

SINGAPORE - 11/24/2009, UNITED STATES--(Marketwire - November 23, 2009) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, announced today that its copper wire bond program is in volume production with the capability to support customers in five different manufacturing locations in Asia.

As the semiconductor industry continues to deliver high performance and cost effective solutions, copper wire bonding has demonstrated feasibility as a low cost alternative. Copper wire bonding provides performance advantages over traditional gold wire bonding including significantly better conductivity than gold or aluminum, improved electrical and thermal performance, and stronger mechanical properties.

Today, STATS ChipPAC has copper wire bond capabilities in its manufacturing locations in Malaysia, Singapore, South Korea, China and Thailand. The Company has been implementing process capabilities for wafer nodes ranging from 250nm down to 45nm.

"We see demand for copper wire bond gaining momentum as a low cost, high performance manufacturing solution for fine-pitch and ultra-fine pitch bonding," said Wan Choong Hoe, Executive Vice President and Chief Operating Officer, STATS ChipPAC. "We are currently qualified on Quad Flat No-Lead (QFN) packages and volume production ramp is ongoing to meet the growth in copper wire bond demand in these packages. We are furthering our development work on more advanced wafer nodes and finer pad pitches as well as on Quad Flat Pack (QFP) and Fine Pitch Ball Grid Array (FBGA) packages as we expect copper wire bond demand to accelerate in 2010."

Forward-Looking Statements

Certain statements in this release are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, deterioration in general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; customer credit risks; possible future application of push-down accounting; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; our ability to generate cash; potential impairment charges; availability of financing; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; classification of the Company as a passive foreign investment company; our ability to develop and protect our intellectual property; rescheduling or canceling of customer orders; changes in our product mix; our capacity utilization; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; shortages in supply of key components; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; changes in environmental laws and regulations; our ability to meet specific conditions imposed for the continued listing or delisting of our ordinary shares on the Singapore Exchange Securities Trading Limited (SGX-ST); exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited ("Temasek") that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labor union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; and other risks described from time to time in the Company's filings with the U.S. Securities and Exchange Commission, including its annual report on Form 20-F dated March 9, 2009. You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.

About STATS ChipPAC Ltd.

STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.

Contact Information: Investor Relations Contact: Tham Kah Locke Vice President of Corporate Finance Tel: (65) 6824 7788, Fax: (65) 6720 7826 email: Media Contact: Lisa Lavin Deputy Director of Corporate Communications Tel: (208) 867 9859 email: