Contact Information: Media Contact : Cain Communications for Sidense Jim Lipman Tel: 925-606-1370 Email:
Sidense Achieves Working Embedded OTP at 65nm
Embedded Non-Volatile Memory IP Ideal for High-Volume, Cost-Effective Solutions
| Source: Sidense
OTTAWA, ON--(Marketwire - November 12, 2007) - Sidense, a leading developer of Logic
Non-Volatile Memory (NVM) IP cores, today announced it has successfully
achieved functional embedded NVM at 65nm silicon and will complete full
qualification in Q1 of 2008. The initial 65nm offering includes
standard/general and low power/leakage processes.
Many high-volume applications are migrating to 65nm and smaller processes.
One difficulty chip designers face at these advanced process nodes is
finding scalable non-volatile storage solutions. Charge-storage NVM
products suffer from data retention issues in standard-logic CMOS process
nodes at 65nm and below. Sidense's patented anti-fuse technology does not
suffer from these data retention problems and scales to geometries below
45nm.
"Many customers have expressed excitement about our technology, which
provides them with a low-power, reliable, and cost-effective path to 65nm,
45nm and beyond," said Xerxes Wania, President and CEO of Sidense. "With
our OTP memory IP, our customers can develop competitive products for a
broad range of applications."
65nm applications are price sensitive and Sidense's patented 1T-Fuse™
provides the industry's smallest NVM bit cell, leading to highly
cost-effective solutions. Additionally, the technology can be manufactured
on a standard-logic CMOS process with no additional masks or process steps.
This latest product offering enhances Sidense's broad NVM product
portfolio, which is currently available from 180nm to 65nm at leading
foundries.
About Sidense
Sidense provides secure, dense and reliable non-volatile one-time
programmable (OTP) memory IP for use in standard-logic CMOS processes, with
no additional masks or process steps required. Sidense's patented
one-transistor 1T-Fuse™ architecture is available from 180nm to 65nm at
leading foundries. Ideal applications include analog trimming, code
storage, encryption keys such as HDCP, RFID and Chip ID, and configurable
processors and logic. For more information, visit www.sidense.com.