SOURCE: Sidense

November 25, 2008 08:00 ET

Sidense to Discuss IP Integration Issues at IP 08

President and CEO Xerxes Wania to Participate on a Panel Debating the Ease of Third-Party Silicon IP Integration

OTTAWA--(Marketwire - November 25, 2008) -


What

CEO and President Xerxes Wania to participate on the panel "Easy Third-Party IP Integration - Fact or Fiction?" that will discuss the problems associated with third-party IP integration and what needs to be done by the IP vendor, IP integrator and other organizations, such as IP portals, to ease the pain of using "outside" IP in SoCs.

Where

IP 08 - IP-Based Electronic System Conference and Exhibition
World Trade Center
5 place Robert Schuman
38 000 Grenoble, France

When

Wednesday, December 3, 2008
16:30 local time

Who

Xerxes Wania, Sidense President and CEO

About Sidense

Sidense, listed on EE Times 60 Emerging Startups list for 2008, provides secure, dense and reliable non-volatile, one-time programmable (OTP) memory IP for use in standard-logic CMOS processes, with no additional masks or process steps required. Sidense's patented one-transistor 1T-Fuse™ architecture (U.S. Patent #7402855 and others) provides the industry's smallest footprint and lowest power Logic Non-Volatile Memory (NVM) solution.

Sidense OTP memory is available at 180nm, 130nm, 90nm and 65nm and scalable to 45nm and below. The IP is available at Chartered Semiconductor, IBM, SMIC, Tower Semiconductor, TSMC and UMC. Customers are using Sidense OTP for analog trimming, code storage, encryption keys such as HDCP, RFID and Chip ID, medical, automotive, and configurable processors and logic. For more information, visit www.sidense.com

Contact Information

  • For more information or to schedule a meeting with Sidense at IP 08 please
    contact:
    Jim Lipman
    Sidense
    Email Contact
    925-606-1370