|
SOURCE: Sidense
|
November 25, 2008 08:00 ET
Sidense to Discuss IP Integration Issues at IP 08
President and CEO Xerxes Wania to Participate on a Panel Debating the Ease of Third-Party Silicon IP Integration
OTTAWA--(Marketwire - November 25, 2008) -
What
CEO and President Xerxes Wania to participate on the panel "Easy
Third-Party IP Integration - Fact or Fiction?" that will discuss the
problems associated with third-party IP integration and what needs to be
done by the IP vendor, IP integrator and other organizations, such as IP
portals, to ease the pain of using "outside" IP in SoCs.
Where
IP 08 - IP-Based Electronic System Conference and Exhibition
World Trade Center
5 place Robert Schuman
38 000 Grenoble, France
When
Wednesday, December 3, 2008
16:30 local time
Who
Xerxes Wania, Sidense President and CEO
About Sidense
Sidense, listed on EE Times 60 Emerging Startups list for 2008, provides
secure, dense and reliable non-volatile, one-time programmable (OTP) memory
IP for use in standard-logic CMOS processes, with no additional masks or
process steps required. Sidense's patented one-transistor 1T-Fuse™
architecture (U.S. Patent #7402855 and others) provides the industry's
smallest footprint and lowest power Logic Non-Volatile Memory (NVM)
solution.
Sidense OTP memory is available at 180nm, 130nm, 90nm and 65nm and scalable
to 45nm and below. The IP is available at Chartered Semiconductor, IBM,
SMIC, Tower Semiconductor, TSMC and UMC. Customers are using Sidense OTP
for analog trimming, code storage, encryption keys such as HDCP, RFID and
Chip ID, medical, automotive, and configurable processors and logic. For
more information, visit www.sidense.com