SOURCE: Tekelec


February 15, 2010 08:00 ET

Tekelec Promotes Vince Lesch to CTO

MORRISVILLE, NC--(Marketwire - February 15, 2010) - Tekelec (NASDAQ: TKLC), the IP core network signaling and mobile data management company, has named Vince Lesch as chief technology officer (CTO). In his new role, Lesch will chart the strategic direction for Tekelec's product portfolio. Lesch will also lead Tekelec's efforts in standards bodies and industry forums to facilitate interoperability and speed development of mobile data technologies. Tekelec participates in organizations such as the GSM Association (GSMA), Internet Engineering Task Force (IETF), Open Mobile Alliance (OMA) and 3rd Generation Partnership Project (3GPP).

"Our customers require new technologies, economies of scale and foresight to plan for the next wave of network evolution," said Frank Plastina, Tekelec's president and CEO. "Vince combines technical depth, product vision and industry expertise to proactively identify customers' needs and Tekelec's growth opportunities."

Lesch joined Tekelec in 2006 and was most recently Tekelec's vice president of product marketing, where he focused on solutions for next-generation and hybrid networks. He brings more than 20 years of experience in telecommunications and software, with a diverse background ranging from large communications services providers such as AT&T to early-stage software startups. His experience also includes Bell Laboratories, Lucent, Predictive Networks, Telcordia Technologies and General Electric in engineering, product management and marketing functions. In addition, Lesch has served on the board of the NGN IMS Forum and the strategic advisory board for Solid Technologies, which was acquired by IBM.

"Tekelec is in a unique position to leverage its strong technology base and knowledge of core networks to help service providers efficiently evolve to all-IP networks and services. We are working with operators around the world to streamline network operations, reduce capex and opex, and migrate to 3G and 4G technology at their own pace," said Lesch.

He has a Bachelor of Science in Mechanical Engineering from the University of Pennsylvania and a Master of Science in Electrical Engineering from Rensselaer Polytechnic Institute.

About Tekelec

Tekelec, a global leader in core multimedia session control, mobile messaging and network intelligence, ensures scalable, secure and highly available communications. The company's market-leading signaling solutions enable the interworking of different network applications, technologies and protocols, providing a smooth transition to next-generation networks. Tekelec has more than 25 offices around the world serving customers in more than 100 countries, with corporate headquarters located near Research Triangle Park in Morrisville, N.C., U.S.A. For more information, please visit

Forward-Looking Statements

Certain statements made in this press release are forward looking, reflect the Company's current intent, belief or expectations and involve certain risks and uncertainties. The Company's actual future performance may differ materially from such expectations as a result of important risk factors, which include, in addition to those identified in the Company's 2008 and upcoming 2009 Form 10-K, 2009 First, Second and Third Quarter Form 10-Qs and its other filings with the Securities and Exchange Commission, the current or further detrimental changes in general economic, social, or political conditions in the countries in which we operate including the impact of credit availability and currency fluctuations on overall capital spending by our customers, the timeliness and functional competitiveness of our product releases, the timing of our recognition of revenues and changes to the accounting rules related thereto, UBS' failure to fulfill its obligation to repurchase the Company's auction rate securities in June 2010, the extent to which any customer outsourcing to our competitors or supplier consolidation increases the influence of competitors on our customers' purchases, our ability to compete with other manufacturers that have lower cost bases than ours and/or are partially supported by foreign governments or employ other unfair trade practices, our ability to integrate acquisitions, our ability to protect intellectual property rights or the risk of infringing and litigating with others regarding their intellectual property rights, our ability to maintain OEM, partner, and vendor support and supply relationships, and changes in the market price of the Company's common stock. The Company undertakes no obligation to publicly update any forward-looking statements whether as a result of new information, future events or otherwise.

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