SOURCE: Varian Semiconductor

January 23, 2008 09:30 ET

Varian Semiconductor Strengthens Its Technology Leadership With the Introduction of the VIISta® HCS

GLOUCESTER, MA--(Marketwire - January 23, 2008) - Varian Semiconductor Equipment Associates, Inc. (NASDAQ: VSEA) announced today that it has introduced and shipped its new product, the VIISta HCS. The VIISta HCS is the sixth-generation, Single Wafer High Current tool that Varian Semiconductor has successfully brought to market for advanced device manufacturers. In addition to holding the number one position in overall implant market share, Varian Semiconductor is also the market share leader in the high current market segment with more than 475 systems shipped worldwide.

The VIISta HCS builds upon Varian Semiconductor's patented "Dual Magnet Ribbon Beam" architecture to further extend the Company's technology leadership. It is designed to deliver superior device performance and yield. The VIISta HCS extends device manufacturers' capability for both yield and productivity.

"At Varian Semiconductor, we continue to work closely with our customers to help them gain a competitive advantage with higher yield and lower costs. Our VIISta high current series is the industry benchmark and production tool of record at most leading-edge memory, logic and foundry manufacturers worldwide. The VIISta HCS will continue to enhance our market leadership," said Gary Dickerson, chief executive officer of Varian Semiconductor. "We thank our customers for supporting our initiatives and making us number one in total implant and number one in high current. Based on the rapid adoption of the VIISta HCS, we expect to build on our technology leadership with the introduction of this product."

Varian Semiconductor has shipped multiple VIISta HCS systems into 65nm production and 45nm development sites. The systems have been accepted into high-volume manufacturing and the Company has received additional follow-on orders from leading logic, memory and foundry chipmakers.

About VIISta HCS

The VIISta HCS delivers superior productivity on a production-proven, single wafer architecture. It is the only high current system designed to ensure both high yield and high productivity using a patented "Dual Magnet Ribbon Beam" architecture to achieve excellent particle performance, in-situ interlocked beam steering for repeatable dopant placement, and a simple one-dimensional wafer scanning endstation for the highest productivity. The VIISta HCS is a member of the VIISta suite of ion implanters -- the only production-proven single wafer platform solution for all implant segments with over 800 systems installed worldwide. For more information on the VIISta HCS, please visit our website at: http://www.vsea.com/products.nsf/docs/viistahcs.

About Varian Semiconductor

Varian Semiconductor Equipment Associates, Inc. is the leading supplier of ion implant equipment to semiconductor manufacturers, enabling them to pack more, higher performing transistors into computer chips that are revolutionizing the electronics industry. Customers have made Varian Semiconductor the market leader in ion implant because of its architecturally superior products that lower their costs and improve their productivity. The Company has ranked #1 in the VLSI Research Customer Satisfaction Survey 10 times over the last 11 years. Varian Semiconductor operates globally and is headquartered in Gloucester, Massachusetts. More information can be found on Varian Semiconductor's web site at www.vsea.com.

Note: This release contains forward-looking statements for purposes of the safe harbor provisions under The Private Securities Litigation Reform Act of 1995. For this purpose, the statements concerning the Company's performance, market share and technology leadership, technological capabilities and benefits are forward-looking statements and any statements using the terms "believes," "anticipates," "expects," "plans," or similar expressions are forward-looking statements. There are a number of important risks and factors that could cause actual events to differ materially from those suggested or indicated by such forward-looking statements. These include, among others, volatility in the semiconductor equipment industry; economic conditions in general and as they affect the Company's customers; significant fluctuations in the Company's quarterly operating results; the impact of rapid technological change; the Company's dependence on the development and introduction of new products; the Company's concentration on ion implantation systems and related products; concentration in the Company's customer base and lengthy sales cycles; the highly competitive market in which the Company competes; risks of international sales; foreign currency risks; and general economic conditions; and other factors identified in the Company's Annual Report on Form 10-K, and the most recent Quarterly Reports on Form 10-Q filed with the Securities and Exchange Commission. The Company cannot guarantee any future results, levels of activity, performance or achievement. The Company undertakes no obligation to update any of the forward-looking statements after the date of this press release.

Contact Information

  • Contacts:
    Bob Halliday
    Executive Vice President
    Chief Financial Officer
    978.282.7597

    Tom Baker
    Vice President of Finance
    978.282.2301

    Mary Wright
    Director, Investor Relations
    978.282.5859