Venga Aerospace Systems Inc.
PINK SHEETS : VNGAF
TSX VENTURE : VAV

Venga Aerospace Systems Inc.

January 24, 2008 08:30 ET

Venga Receives Delivery of Advanced 3D Print/Processor

TORONTO, CANADA--(Marketwire - Jan. 24, 2008) - Venga Aerospace Systems Inc. (TSX VENTURE:VAV)(PINK SHEETS:VNGAF) announces that its 3DP North American Joint Venture has now received delivery of the first of two, CPX-1 3D print / processors that the new joint venturer had purchased from the equipment's Hong Kong based manufacturer. The CPX-1 3D print / processor is capable of mass-producing high resolution, photographic quality, 3D images in various sizes in both reflective and transparent formats. "We are quite excited to be the only source in North America offering this advanced image making equipment," stated Venga's President, Hirsh Kwinter. "The two CPX-1 3D print / processors will give our new joint venture an in-house, domestic based, production capability that will allow us to service our future customers' orders," added Kwinter. The CPX-1 3D print / processors will be located and operated in the 3DP North American Joint Venture's Houston, Texas production facility.

In November of 2006, Venga entered into an agreement with 3DP North America, Inc., of Kenner, Louisiana, United Business & Capital Services, LLC, of Kenner, Louisiana, EKG, LLC, of Lafayette, Louisiana and Armadillo Photo Supply, Inc., of Houston, Texas, creating the 3DP North American Joint Venture to provide a range of advanced 3D products and print services for both commercial and consumer customers.

This press release contains forward-looking statements within the meaning of the "safe harbor" provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are subject to certain risks and uncertainties that may cause the Company's results to differ materially from expectations and speak only as of the date hereof.

SHARES ISSUED: 228,271,893

The TSX Venture Exchange does not accept responsibility for the adequacy or accuracy of this release.

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