Zarlink Semiconductor Inc.
TSX : ZL

Zarlink Semiconductor Inc.

September 08, 2009 09:30 ET

Zarlink Expands VeriVoice Line Test Software to Support Latest Generation of Voice Products for the DSL Market

Demonstrated at Broadband World Forum Europe 2009 (Zarlink booth#165), VeriVoice Line Test Software and VE890 chipset help lower cost and improve quality of voice-over-DSL services

OTTAWA, ONTARIO--(Marketwire - Sept. 8, 2009) - Zarlink Semiconductor (TSX:ZL), the market leader in access infrastructure and residential gateway voice solutions, today announced that its field-proven VeriVoice Line Test software now supports the VE890 chipset series. VeriVoice Line Test software in combination with the VE890 series allows voice-over-IP (VoIP) service providers to lower operating costs and deliver voice services with the same reliability as traditional telephone network operators.

VeriVoice Line Test software allows carriers to routinely and remotely monitor and test voice lines to reduce costly truck rolls and help lower operating costs. In addition, the remote monitoring capabilities allow service providers to detect issues, sometimes in advance of an end-user experiencing a problem, to speed response time and improve service reliability and customer satisfaction.

"Zarlink is leading the VoIP market with over 80 million testable lines deployed worldwide," said Jacques Issa, Director of VoIP Marketing and Applications with Zarlink's Communication Products Group. "Remote line testing capabilities are critical as service providers seek new ways to cost-effectively deliver reliable VoIP services. Zarlink's expanded VeriVoice Test Suite software and VE890 series, backed by our extensive expertise in voice deployments, provides VoIP service providers with a leading solution that reduces operating costs and improves the reliability of their network."

Zarlink's VE890 series is optimized for residential VoIP access devices supporting voice-over-DSL services. The highly integrated, low-powered chipsets help designers more easily comply with "green" performance requirements for broadband equipment, while reducing bill of material (BoM) costs by more than 20 percent compared with competing solutions. For more information on the VE890 chipset, visit http://www.zarlink.com/zarlink/hs/residential_gateways_15664.htm.

Demonstration at Broadband World Forum

Zarlink (booth#165) is demonstrating its expanded VeriVoice Line Test Software in conjunction with VE890 at Broadband World Forum Europe 2009 in Paris, France, September 7-9. Please contact Zarlink for additional information.

About Zarlink Semiconductor

For over 30 years, Zarlink Semiconductor has delivered semiconductor solutions that drive the capabilities of voice, enterprise, broadband and wireless communications. The Company's success is built on its technology strengths including voice and data networks, optoelectronics and ultra low-power communications. For more information, visit www.zarlink.com.

Shareholders and other individuals wishing to receive, free of charge, copies of the reports filed with the U.S. Securities and Exchange Commission and Regulatory Authorities, should visit the Company's web site at www.zarlink.com or contact Investor Relations.

Certain statements in this press release constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements involve known and unknown risks, uncertainties, and other factors which may cause the actual results, performance or achievements of the Company to be materially different from any future results, performance, or achievements expressed or implied by such forward-looking statements. Such risks, uncertainties and assumptions include, among others, the following: our dependence on the successful development and market introduction of new products; our ability to integrate any business, technologies, product lines or services that we have or will acquire; our dependence on revenue generation from our legacy products in order to fund development of our new products; current market conditions, including the lack of liquidity in the markets and economic slowdown, may increase our operating costs or reduce our revenue, thereby negatively impacting our operating results; our ability to operate profitably and generate positive cash flows in the future; the impact of the current economic crisis on our suppliers and customers and our ability to transfer parts to other suppliers; our dependence on our foundry suppliers and third-party subcontractors; order cancellations and deferrals by our customers; our substantial indebtedness could adversely affect our financial position; the cost and accounting implications of compliance with new accounting standards; and other factors referenced in our Annual Report on Form 20-F. Investors are encouraged to consider the risks detailed in this filing.

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