SOURCE: Allvia


March 02, 2011 11:10 ET

ALLVIA to Present Latest Data for Silicon Interposers and Embedded Capacitors at Packaging Forum

SUNNYVALE, CA--(Marketwire - March 2, 2011) - ALLVIA, the first through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the IMAPS Conference on Device Packaging in Scottsdale, AZ, March 9. Dr. Sergey Savastiouk, CEO at ALLVIA, will present a discussion titled: "Silicon Interposers Enable High Performance Capacitors."

The data presented in this paper will show that after several thermal cycles, planar capacitors on silicon results in stable, reliable capacitors operating at very high frequencies. Unlike an issue of parallel resonance seen with chip capacitors, planar capacitors in interposers don't exhibit this property. ALLVIA, on behalf of its foundry customers, has been conducting studies of various capacitors on silicon interposers.

Thin film capacitors without TSVs have been used previously. However, with the interconnect inductance being high, benefits of thin film capacitors have not been fully realized. TSV interposers with embedded capacitors provide the shortest electrical path between devices and power supply decoupling capacitors. TSVs with their very low inductance interconnects thus will enable very high electrical performance when integrated with embedded thin film capacitors.

Through-Silicon Vias/Embedded Capacitors
ALLVIA offers services for prototyping and full volume production of both front side and back side TSVs and a full spectrum of facilities, IP and equipment. They have previously announced they have integrated embedded capacitors on silicon interposers, a key interface between a silicon device and an organic substrate needed for managing high interconnect densities. 3D integration with ALLVIA's through-silicon via technology allows much closer access to high value capacitors than previously possible, leading to a much higher level of electrical performance.

IMAPS Conference and Exhibition on Device Packaging
The International Microelectronics And Packaging Society (IMAPS) is the largest organization dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. This conference will be held at the Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona, March 8-10, 2011. See their website for details.

Located in Silicon Valley, ALLVIA is the first Through-silicon via (TSV) foundry and introduced the term "through-silicon via" in both a 1997 business plan and a January 2000 technical article. With the full spectrum of facilities, IP and equipment, ALLVIA offers services for prototyping and full volume production of both front side and back side TSVs to the MEMS and semiconductor industries as well as silicon etching, copper plating, photolithography, CMP, etc.

Contact Information

  • Company Contact:
    ALLVIA, Inc.
    657 N. Pastoria Ave.
    Sunnyvale, CA 94085 USA
    ph.: 408-720-3333
    Email Contact

    Agency Contact:
    Bruce Kirkpatrick
    Email Contact