SOURCE: Applied Math Modeling

September 09, 2008 10:19 ET

Applied Math Modeling Releases CoolSim 3.1

Includes Support for Non-Raised Floor Data Center Modeling, Improved Graphics, Equipment Libraries and User-Productivity Enhancements

CONCORD, NH--(Marketwire - September 9, 2008) - Applied Math Modeling Inc. announced today the release of CoolSim 3.1 for modeling the thermal environment of data centers. CoolSim 3.1 adds many new features for the rapid creation and analysis of data centers, including the ability to model non-raised floor scenarios. CoolSim is the most cost-effective, comprehensive, easy to use tool in the market for the quick and easy analysis of data centers.

With CoolSim 3.1, users quickly determine such things as the maximum equipment loading for a given data center, the optimal placement of cooling and/or thermal loads, the effect of failed cooling units, and the opportunity to reduce operating costs by reducing cooling capacity. Features of the new CoolSim 3.1 release include:

-- The ability to model raised floor as well as non-raised floor data centers

-- Customized graphics and animations that allow for comparisons between two or more cooling or equipment placement scenarios

-- Topflow, downflow, and frontflow CRACs, with an extensive library of downflow CRACs from Liebert and DataAire

-- Graphical depictions of airflow pathlines, iso-surfaces of temperature, and contours of pressure and temperature, with interactive 3D control to pan, zoom, and rotate the view

Paul Bemis, CEO of Applied Math Modeling said: "With the new release of CoolSim 3.1, users can create and analyze data center design alternatives faster and more accurately than ever before. The new features added to CoolSim 3.1 make it the easiest and most cost-effective data center thermal analysis tool on the market, providing insight that can be obtained in no other manner."

CoolSim has an easy-to-use graphical interface that enables users to quickly create a model of their data center. The model is then automatically submitted to a hosted high-performance computing (HPC) cluster for processing using ANSYS/Fluent computational fluid dynamics (CFD) technology. Once the simulation is complete, HTML output reports and 3D visual images are produced and sent to the user. This mechanism allows users to perform multiple "what-if" studies of their data centers to determine the optimal placement of existing equipment, or the effect of adding new equipment to an existing room.

"At Applied Math Modeling, we believe the application of 3D CFD technology should be made easy to learn, easy to use, and easy to remember. CoolSim 3.1 delivers on this goal for data center thermal modeling. The use of CFD for modeling data centers is a 'best practice' that can now be employed by anyone with a basic understanding of data center cooling and design."

"The latest version of CoolSim is the best yet," said beta tester Chris Ames, Ames Consulting Services. "I have tried it on both new projects and previously designed rooms, and it performs extremely well, even when I throw it some curves. This is another great step forward with a great product. This tool is exactly what I need to help my customers improve data center energy efficiency with regard to precision cooling and advanced heat removal. Keep up the good work!"

CoolSim 3.1 will be demonstrated online at a free webinar scheduled for Wednesday, October 22nd at 2pm ET. For more information and to register, visit

About Applied Math Modeling

Applied Math Modeling Inc develops and supports engineering simulation applications for specific target markets. As a strategic "value added" partner to ANSYS, Applied Math Modeling develops unique graphical user interfaces (GUIs) for target markets that require specific modeling tasks, driven by the rich set of industry proven ANSYS simulation engines. These applications are then delivered to the market using a hosted "Software as a Service" (SaaS) model that is particularly well suited for periodic or occasional users. This unique approach reduces end user IT complexity and cost Visit for more information or