January 23, 2007 08:33 ET

Appointment of Tokumasa Yasui as Director

UNITED STATES -- (MARKET WIRE) -- January 23, 2007 -- SINGAPORE -- 01/23/2007 -- STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (NASDAQ: STTS) (SGX-ST: STATSChP), a leading independent semiconductor test and advanced packaging service provider, today announced the appointment of Mr. Tokumasa Yasui as a non-executive member to its Board of Directors, effective immediately.

"We are delighted to welcome Tokumasa to the Board. With his decades of experience in the semiconductor industry, Tokumasa will be an invaluable addition to the Board," said Charles Wofford, Chairman of STATS ChipPAC.

Tokumasa Yasui is currently Special Advisor to the President of Renesas Solutions Corp., a joint venture between Hitachi Ltd. and Mitsubishi Ltd. Prior to that, he was Managing Director of Renesas Semiconductor, Malaysia. Tokumasa Yasui has also held various senior management positions with Hitachi Ltd. where he last served as Group Executive of the Semiconductor Division. He has also served as Executive Vice President of Elpida Memory, Inc, a joint venture between Hitachi Ltd. and NEC Corp.

Tokumasa Yasui holds a Bachelor of Engineering and a Master of Engineering in Electrical Engineering from Kyoto University.

About STATS ChipPAC Ltd.

STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (NASDAQ: STTS) (SGX-ST: STATSChP) is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions. A trusted partner and supplier to leading semiconductor companies worldwide, STATS ChipPAC provides fully integrated, multi-site, end-to-end packaging and testing solutions that bring products to the market faster. Our customers are some of the largest wafer foundries, integrated device manufacturers (IDMs) and fabless companies in the United States, Europe and Asia. STATS ChipPAC is a leader in mixed signal testing and advanced packaging technology for semiconductors used in diverse end market applications including communications, power, digital consumer and computing. With advanced process technology capabilities and a global manufacturing presence spanning Singapore, South Korea, China, Malaysia and Taiwan, STATS ChipPAC has a reputation for providing dependable, high quality test and packaging solutions. The Company's customer support offices are centered in the United States (California's Silicon Valley, Arizona, Texas, Massachusetts, Colorado and North Carolina). Our offices outside the United States are located in South Korea, Singapore, China, Malaysia, Taiwan, Japan, the Netherlands and United Kingdom. STATS ChipPAC's facilities include those of its subsidiary, Winstek Semiconductor Corporation, in Hsinchu District, Taiwan. These facilities offer new product introduction support, pre-production wafer sort, final test, packaging and other high volume preparatory services. Together with our research and development centers in South Korea, Singapore, Malaysia, China, Taiwan and the United States as well as test facilities in the United States, this forms a global network providing dedicated test engineering development and product engineering support for customers from design to volume production. STATS ChipPAC is listed on both the Nasdaq Stock Market and the Singapore Exchange Securities Trading Limited. In addition, STATS ChipPAC is also included in the Morgan Stanley Capital International (MSCI) Index and the Straits Times Industrial Index. Further information is available at Information contained in this website does not constitute a part of this release.

Contact Information

  • Singapore Contact:

    Bryan Ong
    Investor Relations
    Tel: (65) 6824 7477
    Fax: (65) 6720 7826
    email: Email Contact

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    Drew Davies
    Director, Investor Relations
    Tel: (408) 586 0608
    Fax: (408) 586 0652
    email: Email Contact

    Lisa Lavin
    Marcom Manager
    Tel: (208) 939 3104
    Fax: (208) 939 4817
    email: Email Contact

    The Ruth Group
    David Pasquale
    Executive Vice President
    Tel: (646) 536 7006
    email: Email Contact