Contact Information: Singapore Contact: Bryan Ong Investor Relations Tel: (65) 6824 7477 Fax: (65) 6720 7826 email: Email Contact US Contacts: Drew Davies Director, Investor Relations Tel: (408) 586 0608 Fax: (408) 586 0652 email: Email Contact Lisa Lavin Marcom Manager Tel: (208) 939 3104 Fax: (208) 939 4817 email: Email Contact The Ruth Group David Pasquale Executive Vice President Tel: (646) 536 7006 email: Email Contact
Appointment of Tokumasa Yasui as Director
| Source: STATS ChipPAC
UNITED STATES -- (MARKET WIRE) -- January 23, 2007 -- SINGAPORE -- 01/23/2007 -- STATS ChipPAC Ltd.
("STATS ChipPAC" or the "Company") (NASDAQ : STTS ) (SGX-ST: STATSChP), a
leading independent semiconductor test and advanced packaging service
provider, today announced the appointment of Mr. Tokumasa Yasui as a
non-executive member to its Board of Directors, effective immediately.
"We are delighted to welcome Tokumasa to the Board. With his decades of
experience in the semiconductor industry, Tokumasa will be an invaluable
addition to the Board," said Charles Wofford, Chairman of STATS ChipPAC.
Tokumasa Yasui is currently Special Advisor to the President of Renesas
Solutions Corp., a joint venture between Hitachi Ltd. and Mitsubishi Ltd.
Prior to that, he was Managing Director of Renesas Semiconductor, Malaysia.
Tokumasa Yasui has also held various senior management positions with
Hitachi Ltd. where he last served as Group Executive of the Semiconductor
Division. He has also served as Executive Vice President of Elpida Memory,
Inc, a joint venture between Hitachi Ltd. and NEC Corp.
Tokumasa Yasui holds a Bachelor of Engineering and a Master of Engineering
in Electrical Engineering from Kyoto University.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (NASDAQ : STTS )
(SGX-ST: STATSChP) is a leading service provider of semiconductor packaging
design, assembly, test and distribution solutions. A trusted partner and
supplier to leading semiconductor companies worldwide, STATS ChipPAC
provides fully integrated, multi-site, end-to-end packaging and testing
solutions that bring products to the market faster. Our customers are some
of the largest wafer foundries, integrated device manufacturers (IDMs) and
fabless companies in the United States, Europe and Asia. STATS ChipPAC is a
leader in mixed signal testing and advanced packaging technology for
semiconductors used in diverse end market applications including
communications, power, digital consumer and computing. With advanced
process technology capabilities and a global manufacturing presence
spanning Singapore, South Korea, China, Malaysia and Taiwan, STATS ChipPAC
has a reputation for providing dependable, high quality test and packaging
solutions. The Company's customer support offices are centered in the
United States (California's Silicon Valley, Arizona, Texas, Massachusetts,
Colorado and North Carolina). Our offices outside the United States are
located in South Korea, Singapore, China, Malaysia, Taiwan, Japan, the
Netherlands and United Kingdom. STATS ChipPAC's facilities include those
of its subsidiary, Winstek Semiconductor Corporation, in Hsinchu District,
Taiwan. These facilities offer new product introduction support,
pre-production wafer sort, final test, packaging and other high volume
preparatory services. Together with our research and development centers in
South Korea, Singapore, Malaysia, China, Taiwan and the United States as
well as test facilities in the United States, this forms a global network
providing dedicated test engineering development and product engineering
support for customers from design to volume production. STATS ChipPAC is
listed on both the Nasdaq Stock Market and the Singapore Exchange
Securities Trading Limited. In addition, STATS ChipPAC is also included in
the Morgan Stanley Capital International (MSCI) Index and the Straits Times
Industrial Index. Further information is available at www.statschippac.com.
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