June 26, 2006 03:00 ET

Cadence Mainstreams System-in-Package Design

Cadence RF SiP Methodology Kit and SiP Technologies Enable System-Level IC and Package Co-Design

NICE, FRANCE -- (MARKET WIRE) -- June 26, 2006 -- CDN Live! EMEA -- Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, today announced the availability of the industry's first complete set of EDA products and capabilities that enable the mainstreaming of System-in-Package (SiP) IC design. The Cadence solution addresses the limitations inherent in the current "expert engineering" approach to SiP design by providing an automated, integrated, reliable, and repeatable process to meet the escalating demand for wireless and consumer products. New products include the Cadence® Radio Frequency (RF) SiP Methodology Kit, two new RF SiP products, Cadence SiP RF Architect and Cadence SiP RF Layout, and three new Digital SiP products, Cadence SiP Digital Architect, Cadence SiP Digital SI, and Cadence SiP Digital Layout.

SiPs are used extensively in wireless, networking and consumer-electronics applications such as cell phones, Bluetooth modules, WLAN modules and network packet switching. According to Semico Research Corporation the revenue for SiP contract manufacturers will reach $747.9 million by 2007. With the Cadence SiP solution, companies have the opportunity to expand this market as a broader range of designers gain the ability to bring together many IC and package assembly technologies to create highly integrated products with optimized cost, size and performance.

"We selected Cadence for RF SiP modules because they had the technology, capability and commitment to work with us to define a solution that can be broadly adopted across Freescale enabling us to bring our RF SiP methodology to the next level," said Nigel Foley, analog/RF methodology manager, Freescale Semiconductor, Inc.

The RF SiP Kit includes new Cadence SiP RF products and methodologies for automating and accelerating the entire design process of RF SiPs for wireless communications applications. It also provides customer-proven SiP implementation methodologies based on an 802.11 b/g wireless local-area-network (WLAN) design. This enables fast and streamlined adoption of the SiP design technique with low risk. This Cadence Kit, along with the previously released Cadence RF Design Methodology Kit, expands Cadence's RF design offerings in the wireless segment.

"As a leading provider of foundry solutions for RF ICs, Jazz Semiconductor recognizes the need to address the industry trend towards the use of SiPs in reducing system cost," said Marco Racanelli, vice president of technology and engineering, Jazz Semiconductor. "By integrating our process design kits (PDKs) with the Cadence RF SiP Methodology Kit, Jazz supports Cadence in streamlining the RF SiP design cycle for our joint customers to provide better performance, optimized technology and faster time to market."

Cadence SiP solutions seamlessly integrate into Cadence Encounter® for die abstract co-design, Cadence Virtuoso® for RF module design, and Cadence Allegro® for package/board co-design for end products that are optimized for size, cost, and performance.

"The new Cadence RF SiP Methodology Kit addresses key SiP design challenges such as the lack of integrated tools and methodologies for integrated system, IC, package, and board design and the inability to simulate, verify and analyze complete SiP designs," said Charlie Giorgetti, corporate vice president of Product Marketing at Cadence. "With this kit, customers will be able to realize the benefits of SiP quicker and with reduced risk in sharp contrast with previous solutions."

The goal of the Cadence Kits approach is to enable our customers to accelerate the segment-specific product development. Cadence Kits address design challenges in market segments such as wireless, wired networking or consumer applications by combining verified methodologies and flows, with IP and demonstrated on a segment representative design and packaged with consulting. By using Cadence Kits, customers can focus their precious design resources on design differentiation rather than design infrastructure.

More information about the Cadence RF SiP Kit and the Cadence SiP technology is available at

About Cadence

Cadence enables global electronic-design innovation and plays an essential role in the creation of today's integrated circuits and electronics systems. Customers use Cadence software and hardware, methodologies, and services to design and verify advanced semiconductors, printed-circuit boards and systems used in consumer electronics, networking and telecommunications equipment, and computer systems. Cadence reported 2005 revenues of approximately $1.3 billion, and has approximately 5,000 employees. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at

Cadence, the Cadence logo are registered trademarks of Cadence Design Systems, Inc. in the U.S. and other countries.

Contact Information

  • For more information, please contact:

    Doron Aronson
    Cadence Design Systems, Inc.