SOURCE: Carsem, Inc.

March 10, 2005 09:00 ET

Carsem Receives Excellent Achievement Award From Elmos

SCOTTS VALLEY, CA -- (MARKET WIRE) -- March 10, 2005 -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they were recently presented with an Excellent Achievement award from ELMOS Semiconductor.

Mr. Dieter Bitterhoff, Manager of Assembly and Off-Shore Operations at Elmos, presented the award to David Comley, Carsem's Group Managing Director, for recognition of Carsem's achievement of excellent assembly performance for automotive products for 2003 and 2004.

Mr. Bitterhoff stated, "Carsem has provided outstanding performance over the previous period and excellent customer service with prompt and pro-active support."

The member of the Board for Production of Elmos, Mr. Reinhard Senf, further stated, "Carsem is also our strategic partner in regards of our planned move into the MLP, SiP and power MLP package family."

Mr. Comley, stated, "I am very proud to have received this award from Elmos. The automotive electronics industry is very demanding and our team of engineers and support staff have done an outstanding job in partnering with the Elmos organization. We look forward to supporting Elmos well into the future."

About ELMOS Semiconductor

ELMOS Semiconductor AG is a developer and producer of customer specific system solutions based on silicon. For more than 20 years, roughly 90 percent of the turnover is achieved with ASICs for automotive electronics. ELMOS is listed on the TecDAX 30 of the German Stock Exchange. Web site: www.elmos.de

About Carsem

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.

Contact Information

  • Press Contact:
    Paul Smith
    Director of Marketing
    Carsem, Inc.
    Telephone Number: 831 438-6861
    Fax Number: 831 438-6863
    Email Address: psmith@carsem.com
    Web site address: www.carsem.com