SOURCE: Cascade Microtech

Cascade Microtech

April 14, 2016 14:57 ET

Cascade Microtech Introduces Fully-Integrated Solution for Wafer-Level Reliability Test

Estrada™ Offers a Low-Risk, Faster Path to Collecting and Evaluating High-Volume Reliability Data

BEAVERTON, OR--(Marketwired - Apr 14, 2016) -  Cascade Microtech, Inc. (NASDAQ: CSCD), a leading supplier of solutions that enable precision measurements of integrated circuits at the wafer level, today announced the launch of the Estrada system; a self-contained, fully-functional test cell for evaluating intrinsic reliability of semiconductor devices directly on the wafer. Estrada systems perform semi-automated wafer-level reliability (WLR) testing of devices for TDDB, SILC, HCI, and conventional NBTI/PBTI wear out per industry-accepted methods.

Semiconductor manufacturers are experiencing increasing demand for low-cost, low-power devices to support the proliferation of servers, PCs, mobile devices, internet of things (IoT), wearables, and a multitude of higher-power communications, lighting, and power conversion applications. Facing shrinking margins and smaller form factors, but increasing requirements for storage and speed, new materials and new structures are seeing mainstream adoption. Significant work is necessary to qualify the long-term performance of these new technologies, as well as enable the advances of future generations.

Estrada is a comprehensive reliability test solution comprising high-performance subsystems such as a semi-automated analytical probe station with thermal chuck, a customized single- or multi-site probe card, reliability test instrumentation, test executive software, and all necessary accessories. This pre-validated solution simplifies the process of specifying and deploying WLR lab tools.

The Estrada system's performance benefits include high-parallel capacity for throughput, automation to step across the wafer for additional unattended testing, package-level reliability correlation, and continuous/fast monitoring for accurate device breakdown characterization. With its ability to collect and analyze a vast amount of statistical data on a large number of test devices, the high-performance Estrada solution accelerates development cycles and fab line qualifications.

"As pressure increases to design and manufacture devices quickly, our customers need immediate access to tools that can address new materials and complex structures," says Michael Burger, President and CEO, Cascade Microtech. "We developed the Estrada integrated measurement solution to enable our customers to quickly provide key data for qualification of semiconductor fab lines, process monitoring, and wafer technology optimization. We are proud to enable a faster, lower-risk path to first data for our customers facing complex reliability test challenges."

Product Availability
Several pre-validated Estrada packages are available today for 300 mm wafer testing. Probe card configurations include single-site and full-wafer, multi-site solutions. Cascade Microtech's Symphony™ parallel reliability testers provide both low-voltage and high-voltage instrumentation options. All package solutions are built upon Cascade Microtech's CM300 semi-automated probe station. A worldwide team provides support and fast deployment of these high-throughput WLR solutions. Visit or contact your local representative to learn more.

About Cascade Microtech, Inc.
Cascade Microtech, Inc. (NASDAQ: CSCD) is a worldwide leader in precision contact, electrical measurement and test of integrated circuits (ICs), optical devices and other small structures. For technology businesses and scientific institutions that need to evaluate small structures, Cascade Microtech delivers access to electrical data from wafers, ICs, IC packages, circuit boards and modules, MEMS, 3D TSV, LED devices and more. Cascade Microtech's leading-edge stations, probes, probe cards, advanced thermal subsystems and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing of high-speed and high-density semiconductor chips. For more information visit

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