SOURCE: Cascade Microtech

Cascade Microtech

May 14, 2015 14:32 ET

Cascade Microtech Showcases Solutions for Advanced RF/mmW/THz Measurement at MTTS 2015 in Phoenix, Arizona

BEAVERTON, OR--(Marketwired - May 14, 2015) - Cascade Microtech, Inc. (NASDAQ: CSCD), will be demonstrating several innovative solutions and applications in booth #945 at the International Microwave Symposium (IMS) conference in Phoenix, Arizona May 19-21, 2015. On display will be Cascade Microtech's new millimeter-wave manual probe system package for 200 mm on-wafer measurements, as well as a fully-integrated 200 mm semi-automated on-wafer THz probing system. Cascade Microtech offers the largest selection of probes in the industry, and will highlight its newest addition, the T-Wave™ family of probes. The company will also demonstrate both its renowned WinCal XE™ calibration software and Velox™ 2.0 -- its new probe station control software.

At IMS/MTTS, Cascade Microtech will provide hands-on demonstrations of its newest pre-configured probing package for manual 200 mm on-wafer measurements, the EPS200MMW. This latest probe system addresses measurement needs for advanced applications above 67 GHz, specifically at 200-300 GHz and beyond. Similar to the EPS150MMW platform, the EPS200MMW is engineered using proven design methods to achieve the highest measurement accuracy in its class.

The EPS200MMW is compatible with all current SIGMA™ integration kits for the EPS150MMW, enabling a wide range of mmW application integrations. Especially at 200-300 GHz frequencies and beyond, probe placement with sub-micron accuracy on calibration substrates and DUTs is critical for accurate and repeatable measurement results. The EPS200MMW addresses this need with its rigid case-base frame, solid platen with four-point support, and a highly-refined granite base plate. Its innovative fine-glide chuck stage offers both wide-range coarse movement and submicron-level fine movement, in combination with a rigid support, making the EPS200MMW the best choice for applications up to the THz range.

Cascade Microtech will also feature the industry's first 200 mm fully-integrated semi-automated on-wafer THz probing system. With the Summit™ probe station robust, calibrated measurement results can be achieved at frequencies from 140 GHz to 1.1 THz. The Summit semi-automated 200 mm probe station can be configured with programmable positioners to allow rapid and repeatable sub-micron positioning accuracy to ensure the highest precision at the probe tip. See how WinCal XE makes calibration easy, and how Velox probe station control software enhances productivity.

Cascade Microtech will exhibit its T-Wave™ family of probes for on-wafer electrical measurement of devices and materials with frequencies from 140 GHz up to 1.1 THz. The T-Wave probe's innovative silicon probe tip addresses not only small pitches as narrow as 25 µm, but also delivers low contact resistance and insertion loss of less than 1.5 dB between 140 GHz and 220 GHz. The T-Wave probe has excellent tip visibility for accurate probe placement, and with easily replaceable probe tips, cost of ownership is significantly reduced.

Join Cascade Microtech at booth # 945 to see the latest comprehensive suite of products and solutions that help reduce cost, time, and ultimately deliver products to market -- faster. A team of experts will be on site to answer questions and provide expertise. 

About Cascade Microtech, Inc.
Cascade Microtech, Inc. (NASDAQ: CSCD) is a worldwide leader in precision contact, electrical measurement and test of integrated circuits (ICs), optical devices and other small structures. For technology businesses and scientific institutions that need to evaluate small structures, Cascade Microtech delivers access to electrical data from wafers, ICs, IC packages, circuit boards and modules, MEMS, 3D TSV, LED devices and more. Cascade Microtech's leading-edge stations, probes, probe cards, advanced thermal subsystems and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing of high-speed and high-density semiconductor chips. For more information visit www.cascademicrotech.com.

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