SOURCE: CollabNet


May 16, 2011 06:00 ET

CollabNet's Guy Martin to Present at Systems & Software Technology Conference 2011 Community Manager Will Speak on New Community Layer

BRISBANE, CA--(Marketwire - May 16, 2011) - CollabNet®, the leader in Agile application lifecycle management (Agile ALM) in the Cloud, announced today that Community Manager Guy Martin will speak at the Systems & Software Technology Conference. Martin will deliver an introduction to, a family of services provided to support the DoD's collaborative software development, with a focus on the new " Community Layer." Martin will explain how 'Community' helps bring stakeholders from the larger DoD community together to work on problems and issues that can span multiple software and technology projects. The talk will be part of the "Resilient Software: Security Automation and Measurement Enablers" track sponsored by the Department of Homeland Security's National Cyber Security Division.

The Systems & Software Technology Conference will be held May 16-19 at the Salt Palace Convention Center. More information about the conference is available at

Guy Martin, CollabNet community manager

"An Introduction to" This presentation will provide an introduction to the program and expand on the Community Layer.

Wednesday, May 18, session time TBD.

Systems & Software Technology Conference 2011
Salt Palace Convention Center
100 South West Temple
Salt Lake City, UT 84101

About CollabNet
CollabNet is the recognized leader in leveraging collaboration, Agile methods, and Cloud computing to transform the way software development organizations develop and deploy applications. We enable our customers to efficiently manage lifecycles, development processes, distributed teams, and projects. Our lightweight and easy-to-use platform, offered in the Cloud on the Codesion hosting platform and in on-premises versions, delivers substantial cost, quality, and time-to-market improvements to more than 7,000 customers, from workgroups to enterprises. For more information, please visit

Contact Information

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