SOURCE: Sidense

September 05, 2007 12:01 ET

Come See Sidense at the FSA Expo

Company to Discuss the Exploding Need for Low-Cost, Secure, and Dense Embedded Non-Volatile Memory (NVM) for a Broad Range of Applications

SANTA CLARA, CA--(Marketwire - September 5, 2007) -


Sidense is exhibiting at the FSA Suppliers Expo and Conference. Hear how Sidense's patented 1T-Fuse™ technology can provide chip and system designers with the most secure, dense and reliable embedded non-volatile memory (NVM) for both digital and analog equipment.


Booth 116
Santa Clara Convention Center
Santa Clara, CA


9AM - 6PM
Wednesday, September 12


Xerxes Wania, Sidense President and CEO

About Sidense

Sidense provides secure, dense, low power and reliable non-volatile one-time programmable (OTP) memory IP for use in standard-logic CMOS processes, with no additional masks or process steps required. Sidense's patented one-transistor 1T-Fuse™ architecture is available from 180nm to 65nm at leading foundries. Ideal usage includes analog trim, code storage, encryption keys such as HDCP, and chip ID for applications ranging from handheld products such as PDAs and cell phones to flat panel displays and wireless networks. The company has offices in Mississauga and Ottawa, Canada and sales offices in San Francisco, CA and Tokyo, Japan. For more information, visit

Contact Information

  • For more information or to schedule a meeting with Sidense please contact:

    Jim Lipman
    Cain Communications
    Email Contact