SOURCE: Cubic Wafer

October 25, 2006 09:00 ET

Cubic Wafer to Present at 3D Architectures for Semiconductor Integration and Packaging Conference

AUSTIN, TX -- (MARKET WIRE) -- October 25, 2006 --

What:    President and CTO of Cubic Wafer, Inc., John Trezza, provides
         insight about 3D chip stacking through-die via development
         focusing on alleviating chip-to-chip communication bottleneck.
         From process, yield, reliability, to performance, Mr. Trezza will
         present a way to enable system-on-a-chip as well as the company's
         vision for stacked-die applications, utilizing a programmable
         virtual backplane.

Who:     Targeting senior-level technologists, managers, and business
         executives from the world's leading companies and research
         institutions, the conference addresses a full range of interests
         for designers, manufacturers, suppliers, and end users.

When:    October 31 through November 2, 2006

Where:   San Francisco Airport Marriott
         Burlingame, Calif.
About Cubic Wafer

Cubic Wafer is a privately owned company that delivers proprietary platform technology to accomplish 3D chip stacking and integration without the size and scalability limitations of conventional flip-chip and wire bond approaches. Cubic Wafer's technology fuses integrated circuits (ICs) at the die or wafer level thereby replacing expensive system-on-chip or system-in-package solutions by providing unlimited integration capabilities and leveraging best-in-category materials and suppliers. The result enables breakthrough high-density, high-performance, multi-material and multi-functional ICs for the consumer electronics, digital, wireless and data communications industries. Based in Austin, Texas, Cubic Wafer has a development center in Merrimack, New Hampshire. For more information on Cubic Wafer, visit or email

Contact Information

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