SOURCE: NXP Semiconductors

NXP Semiconductors

NXP Semiconductors

April 19, 2011 04:00 ET

Deutsche Bahn and NXP Continue Cooperation on "Touch&Travel"

EINDHOVEN, NETHERLANDS--(Marketwire - Apr 19, 2011) - Deutsche Bahn and NXP Semiconductors N.V. (NASDAQ: NXPI) today announced to continue their co-operation on "Touch&Travel" in Germany. "Touch&Travel" is a mobile ticketing scheme which is running in a pilot phase in Germany since 2008. Using Near Field Communication (NFC) the ticketing system enables e-ticketing based on NFC-enabled mobile phones. Deutsche Bahn and NXP together with other project partners co-operated in the pilot phase and are now joining forces to successfully bring "Touch&Travel" into the market.

"Touch&Travel" is an innovative mobile ticketing scheme with low infrastructure costs, which enables customers to use NFC-based mobile phones for fast and easy e-ticketing. The contactless technology of NFC allows passengers to conveniently purchase tickets by bringing the mobile phone close to "Touch&Travel" Touchpoints. Data is transmitted through an existing infrastructure -- the mobile phone network -- and payment for travel is securely made. The fare is calculated automatically and the billing is done on regular basis.

This system provides a simple and flexible access to public transport in Germany. Customers benefit by the unlimited access to travel across different means of transport by just using the NFC-enabled mobile phone for check-in and check-out. As the Touchpoint and the mobile phone are equipped with latest secure elements, the system combines high security demands and compliance to the German e-ticketing standard VDV-KA with ease of use.

"By driving the NFC technology and its leadership in secure contactless technologies in transportation, NXP is a competent partner for Deutsche Bahn in the project," says Birgit Wirth, Head of Project Mobility at Deutsche Bahn. Ruediger Stroh, Executive Vice President and General Manager, Identification Business at NXP Semiconductors, adds: "The 'Touch&Travel' project as a nationwide German use case for mobile ticketing will be a catalyst for the deployment of NFC phones in Germany. By its early involvement in NFC, Deutsche Bahn has shown that the company is at the forefront of innovation and values innovative contactless technology as opportunity to provide high customer comfort and security standards by using mobile ticketing schemes."

NFC is a market proven technology co-invented by NXP in 2002. In 2004 NXP co-founded the NFC Forum to lead the collaboration with all industry stakeholders and help standardize the technology. NFC technology evolved from a combination of contactless identification (RFID) and interconnection technologies. Ranked as the number one contactless IC vendor by ABI Research for three years in a row, NXP is the global leader in NFC solutions, field proven in over 150 NFC trials and landmark commercial deployments worldwide. NXPs recently announced co-operation with Google on implementing an NFC stack in Google's latest Android operating system, which will further speed up the market deployment of NFC.

Today, NFC offers consumers a high level of convenience, interactivity and security with their mobile devices, and further enhances their smartphone experiences by linking the virtual world of applications with the physical environment. Using natural touch gestures NFC devices can easily pair with accessories, interact on a peer-to-peer level to exchange data, and connect to a huge installed base of reader and tag infrastructures.

For more information on NFC please visit
For more information on Touch&Travel visit

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 30 countries, NXP posted revenue of $4.4 billion in 2010. For more information, visit

Forward-looking Statements
This document includes forward-looking statements which include statements regarding our business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions, our ability to successfully introduce new technologies and products, the demand for the goods into which our products are incorporated, our ability to generate sufficient cash, raise sufficient capital or refinance our debt at or before maturity to meet both our debt service and research and development and capital investment requirements, our ability to accurately estimate demand and match our production capacity accordingly or obtain supplies from third-party producers, our access to production from third-party outsourcing partners, and any events that might affect their business or our relationship with them, our ability to secure adequate and timely supply of equipment and materials from suppliers, our ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly, our ability to form strategic partnerships and joint ventures and successfully cooperate with our alliance partners, our ability to win competitive bid selection processes to develop products for use in our customers' equipment and products, our ability to successfully establish a brand identity, our ability to successfully hire and retain key management and senior product architects; and, our ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and our business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, our market segments and product areas will develop. We have based these assumptions on information currently available to us, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While we do not know what impact any such differences may have on our business, if there are such differences, our future results of operations and our financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, we do not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, or from the SEC website,