SOURCE: eSilicon


January 25, 2010 08:00 ET

eSilicon to Participate in DesignCon Panel: "Exploring the Business Aspects for 3-D Device Success"

SANTA CLARA, CA--(Marketwire - January 25, 2010) -

What:   eSilicon, along with other leading technologists, will discuss the
        feasibility of stacked-die 3-D packaging for the future

When:   Tuesday, February 2, 2010
        10:10 - 11:40 AM

Where:  DesignCon 2010
        Santa Clara Convention Center
        Ballroom H

Who:    Moderator: Ed Sperling, Chip Design/SLD
        Panelists: Rajiv Maheshwary, Synopsys
                   Javier DeLaCruz, eSilicon
                   Glenn Daves, Freescale Semiconductor
                   Carey Robertson, Mentor Graphics

Panel Abstract

While debate rages over when Moore's Law hits a technology wall, a few enterprising technologists have moved beyond debate and are looking at stacked die or 3-D packaging as the path to future functionality. And while stacked die technology has proven feasible, it may be the business aspects of bringing this paradigm to fruition that prove the most challenging. Stacked die, or 3-D device technology, is the processes of integrating up to three die within a single semiconductor package. Such an approach makes it possible to mix and match lithographic geometries. But the question arises: Who is going to put it all together so that all parties in the supply chain can make money? The panel will address strategic questions like: What pieces are missing for critical success? Who will benefit the most from the 3-D approach? And if the companies who will benefit the most are not paying for the required research, who will pay and what is in it for them?

About eSilicon

eSilicon, a pioneering semiconductor Value Chain Producer (VCP), provides a comprehensive suite of design, productization and manufacturing services, enabling a flexible, low-cost, lower-risk path to volume chip production. The company delivers application specific integrated circuits (ASICs) to system original equipment manufacturers (OEMs) and fabless semiconductor companies who serve a wide variety of markets including the consumer, computer, communications and industrial segments. eSilicon -- Enabling Your Silicon Success™. For more information, please visit

eSilicon and the eSilicon logo are registered trademarks, and Enabling Your Silicon Success is a trademark, of eSilicon Corporation. Other trademarks are the property of their respective owners

Contact Information

  • For more information or to schedule a meeting with eSilicon at DesignCon,

    Susan Cain
    Cain Communications
    Email Contact

    Kalar Rajendiran
    eSilicon Corporation
    Email Contact