SOURCE: eSilicon Corp.

November 17, 2008 12:36 ET

eSilicon COO Jim Kupec to Participate on a Panel Addressing Productivity Challenges in Today's Economic Conditions

Discussion Will Focus on Proven Methods That Will Help High-Tech Companies Navigate Through the Current Economic Storm

SANTA CLARA, CA--(Marketwire - November 17, 2008) -


WHAT: Jim Kupec, chief operating officer of eSilicon Corporation, will
participate on an executive panel discussion sponsored by the Silicon
Valley Bank, The EDA Consortium (EDAC) and Cayenne Communications. The
Panel, which will also feature executives from US Venture Partners, Alloy
Ventures, Synfora, Inc., and Teranetics, is titled "Making it Through Tough
Times: How to Get More Productivity with Fewer Resources." It will focus
specifically on the current issues impacting high-tech companies. The
panelists will discuss strategies that can be used to deal with the current
challenging economic conditions and the necessary steps that need to be
implemented to help companies get better positioned for the future.

WHEN:   Wednesday, November 19, 2008 at 6:00PM

WHERE:  Silicon Valley Bank Financial Group
        Kellogg Auditorium
        3005 Tasman Drive
        Santa Clara, CA

For more information or to register to attend, go to:
http://www.cayennecom.com/seminar

WHO:  eSilicon, a leading Value Chain Producer (VCP) for the semiconductor
industry, provides a comprehensive suite of design, productization and
manufacturing services, enabling a flexible, low-cost, lower-risk path to
volume chip production. The company delivers custom chips (ASICs) to system
OEMs and fabless semiconductor companies who serve a wide variety of
markets including the consumer, computer, communications and industrial
segments. For more information, please go to www.esilicon.com.

eSilicon and the eSilicon logo are registered trademarks of eSilicon Corporation. Other trademarks are the property of their respective owners.

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