eSilicon to Present on Advanced Technologies for Packaging and Physical IP at DAC 2013

SUNNYVALE, CA--(Marketwired - May 29, 2013) -  

What:
eSilicon will present on emerging packaging technologies as well as advanced physical IP -- including the challenges of FinFET and FD-SOI technologies that will take us to 14nm.

Where:
Design Automation Conference (DAC 2013)
Austin, Texas

When:
June 2-5, 2013

Who:

Advanced Technologies Driving Selective Memory Customization
ChipEstimate.com Booth #2446
eSilicon's Patrick Soheili, VP and GM, IP Solutions Group, and Lisa Minwell, senior director, IP Solutions Marketing, will present.

• Monday, June 3, 11:30 AM
• Tuesday, June 4, 2:00 PM
• Wednesday, June 5, 1:30 PM

What's beyond 28nm? Advanced IP for Advanced Chip Solutions
GLOBALFOUNDRIES Open Theater Booth #1314
eSilicon's Patrick Soheili, VP and GM, IP Solutions Group, will present.

• Tuesday, June 4, 3:45 PM

Concurrent Design Delivers Innovative Package for Fast Time-to-Market Solution
GLOBALFOUNDRIES Open Theater Booth #1314
eSilicon's Gino Skulick, VP and GM, SDMS Solutions, will present an integrated approach to a very low cost, low power, small form factor device produced for the mobile market.

• Monday, June 3, 2:45 PM
• Wednesday, June 5, 11:05 AM

Targeted IP Solutions for Mobile, Compute, Connect and Store
GLOBALFOUNDRIES Private Theater Booth #1314
eSilicon's Lisa Minwell, senior director, IP Solutions Marketing, will present.

• Wednesday, June 5, 2:00 PM

About eSilicon
eSilicon, the largest independent semiconductor design and manufacturing services provider, delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk path to volume production. eSilicon serves a wide variety of markets including the communications, computer, consumer and industrial segments. www.esilicon.com.

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