SOURCE: eSilicon

eSilicon

April 01, 2014 08:30 ET

eSilicon's Javier DeLaCruz to Moderate the 2.5D/3D Packaging Panel at the GSA Silicon Summit

SAN JOSE, CA--(Marketwired - Apr 1, 2014) -

What: Enabling a 2.5D/3D Ecosystem

Where:
GSA Silicon Summit
Computer History Museum, Mountain View, California

When:
April 10, 2014
1:15-2:15 PM

Who: Javier DeLaCruz, senior director of engineering, eSilicon Corporation

Panelists:

  • Calvin Cheung, VP of engineering, ASE U.S.
  • Bob Patti, CTO & VP of design engineering, Tezzaron
  • Dr. Riko Radojcic, director, advanced technology engineering, Qualcomm Incorporated
  • Dr. Arif Rahman, program director & architect, Altera Corporation
  • Brandon Wang, director, 3D-IC solutions, Silicon Realization Group, Cadence Design Systems, Inc.

Abstract: 2.5 & 3D package technology holds great promise for enabling heterogeneous integration and reducing design complexity. The keynote address will provide an overview on where the industry stands in terms of developing and commercializing 2.5D/3D semiconductor technology and what remains to be done. A panel discussion will follow and address the use case for 2.5D/3D package technology, as well as the business needs within the supply chain in order to ignite 2.5D/3D package technology adoption and market growth, changing it, if possible, from a nascent alternative to a mature option.

About Javier DeLaCruz
Javier DeLaCruz is the senior director of engineering at eSilicon Corporation. He is responsible for foundry, packaging, signal integrity, product and test engineering. He has also led eSilicon's 2.5D and 3D MoZAIC™ package system initiatives. DeLaCruz has over 17 years of experience in semiconductor packaging and is a senior member of IEEE. He has extensive knowledge in analog design, high-speed digital design, thermal and electrical simulation, and package assembly.

About eSilicon
eSilicon, the largest independent semiconductor design and manufacturing services provider, delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk path to volume production. eSilicon serves a wide variety of markets including communications, computer, consumer, industrial and medical. http://www.esilicon.com

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Contact Information

  • For more information, please contact:
    Sally Slemons
    eSilicon Corporation
    408.635.6409
    Email Contact

    Susan Cain
    Cain Communications
    408.393.4794
    Email Contact