SOURCE: BAI

BAI

February 11, 2015 15:53 ET

Federal Reserve to Address Newly Released U.S. Payments Roadmap at BAI Payments Connect 2015 in Phoenix

CHICAGO, IL--(Marketwired - Feb 11, 2015) - The Federal Reserve reminded the payments community Feb. 10 that it's prepared to take a more operational role if market forces don't propel the U.S. quickly enough along the path to faster, more secure transactions. As part of its continued effort to help the financial services industry speed up payments and reduce fraud, senior Federal Reserve executives will be presenting March 2-4 at this year's BAI Payments Connect 2015 Conference & Expo in Phoenix, Arizona. Interactive sessions featuring senior Fed officials include The Fed Town Hall, Overcoming Obstacles to a Faster, Safer U.S. Payments System: A Payments Town Hall, Strategies for Improving the U.S. Payments System, and Rails for Real Time. The conference provides a rare, public opportunity for financial institutions to react to the Federal Reserve's proposal for the U.S. payments system and offers open forums in which financial institutions can hear how their peers and more sophisticated competition feel about key issues, priorities and pace of change in the Fed's proposals.

BAI Payments Connect 2015 is a one-of-a-kind industry event focusing on the actionable insights and innovative solutions that payments leaders need to refine their strategies and achieve business goals in the complicated payments landscape. The three-day conference is the only event devoted exclusively to the impact of payments change on financial institutions and banking leaders. The program provides an opportunity to engage with payments thought leaders and gain fresh perspectives and the latest thinking around the industry's hottest topics, such as: the cost of EMV to issuers, the future of Apple Pay and mobile payments, and whether or not faster payments equal faster fraud.

For more information about BAI Payments Connect 2015, please visit BAIPaymentsConnect.com.

About BAI
BAI is the financial services industry's resource for breakthrough information and intelligence needed to innovate and stay relevant in an evolving marketplace. For 90 years, BAI has provided the industry with unbiased and objective education and research. BAI's offerings are as diverse as the industry, and include premier events such as BAI Payments Connect Conference & Expo, groundbreaking research, professional learning and development programs, and in-depth editorial coverage through BAI Banking Strategies. For more information, visit www.bai.org.

BAI is Bank Administration Institute and BAI Center.

About BAI Payments Connect
BAI Payments Connect is the industry's premier payments conference. The event is attended by more than 700 payments professionals and solutions providers who converge to focus on current issues, challenges, and opportunities in the payments space. This highly engaging, interactive event provides attendees with practical solutions needed to manage disruptive technology, build customer relationships, streamline check and payment operations, reinforce cyber security efforts, and grow payments revenue streams. For more information visit: BAIPaymentsConnect.com

Contact Information

  • For further information please contact:
    Lucas Gochanour
    BAI, Chicago, USA
    Phone: +1 312 683-2329
    lgochanour@bai.org