SOURCE: Tech Soft 3D

Tech Soft 3D

February 24, 2010 09:00 ET

First Ever Tech Soft 3D Customer Gathering at COFES

Meeting to Focus on Strategic Implications of HOOPS Product Road Map and Future Technologies

BERKELEY, CA--(Marketwire - February 24, 2010) - Tech Soft 3D (TS3D), the leading provider of 3D component technology to the engineering software industry, today announces its first ever Customer Meeting on April 15 at COFES -- The Congress on the Future of Engineering Software -- in Scottsdale, Arizona.

"Like COFES, this event will be tailored to the interests of senior executives," says TS3D CEO Ron Fritz. "There are significant changes occurring in areas such as application architectures, customer expectations and market dynamics. We'll be talking about these trends and what we're doing to help our customers stay ahead of the curve -- as well as the competition."

Attendees can expect to hear about the key capabilities in version 18 of the HOOPS 2D/3D graphics engine and how these can be used to strategic advantage. Tech Soft will also review the HOOPS product road map and how it fits with technology trends in the engineering software industry. The meeting will also be the exclusive platform for other exciting TS3D announcements.

Tech Soft 3D has made arrangements with COFES to extend an invitation to those interested in attending this Tech Soft 3D event. Contact Ron Fritz (ron@techsoft3d.com) for details. The event will be from 1-3 p.m. at the Scottsdale Plaza Resort, Las Palmas Room "A."

"Talking makes us thirsty -- so there just might be a round on us if you make it through the full two hours," added Fritz.

Learn more about the Tech Soft 3D Customer Meeting (http://www.techsoft3d.com/ts3d_customer_meeting.html).

About COFES

COFES is a unique conference that focuses on intense sessions of discussion, argument and debate on issues that will affect businesses that invest in and depend upon engineering technologies. The 11th annual COFES runs Thursday, April 15 through late Saturday night, April 17. See the COFES (www.cofes.com) Web site for additional information on the agenda, keynote speakers and registration.

About Tech Soft 3D

Tech Soft 3D (TS3D) provides premier component technologies and related services that enable software developers to rapidly create world-class technical software. The company's flagship HOOPS® technology has been incorporated into nearly 200 commercial software applications. In addition to the flagship HOOPS technology, the company also resells premium components such as Autodesk's RealDWG® Toolkit, the Adobe 3D OEM Platform, and Parasolid Modeling Kernel from Siemens PLM. The company maintains corporate headquarters in Berkeley, California and can be reached through www.techsoft3d.com.

All brand and product names are trademarks or registered trademarks of their respective owners.

Contact Information

  • Tech Soft 3D Media Contact:
    Ron Fritz
    Phone: (541)383-4661
    Email Contact