Gennum Corporation

Gennum Corporation

September 12, 2008 03:00 ET

Gennum 3Gb/s Solutions Selected for Ensemble's Next-Generation Broadcast Signal Generator

Integrated, Single-chip Transmit Solution Enables Ensemble to Deliver 3G Design in Less Than Three Months

AMSTERDAM, NETHERLANDS--(Marketwire - Sept. 12, 2008) - IBC2008 Gennum Booth #10.A29 - IBC2008, Continuing to spur 3 gigabits per second (Gb/s) design and infrastructure development, Gennum Corporation (TSX:GND) announced today that Ensemble Designs has selected the company's leading 3Gb/s transmit solution for Ensemble's next-generation test signal generator (TSG), a critical piece of equipment used to distribute test signals in broadcast studios. A leading provider of signal processing and infrastructure products to the professional broadcast industry, Ensemble developed the signal generator/synchronizing pulse generator (SPG) using Gennum's single-chip solution in just under three months. This TSG/SPG will be showcased this week at IBC2008.

"Ensemble's product represents the tremendous time-to-market advantages that our transmit and receive solutions offer companies developing 3G equipment, particularly as the transition to HD gathers momentum beyond North America," said Vijay Sharma, Director of Marketing, A/V Connectivity, of Gennum. "With this success, Ensemble showcases the ability for the broadcast industry to quickly and easily migrate to 3Gb/s-capable equipment such as cameras and monitors, which are essential for content generation and display of uncompressed 1080p 50/60 and RGB 4:4:4:4 video signals."

Ensemble was able to significantly reduce typical design time for this product, in large part due to the single-chip solution provided by Gennum. The highly integrated GS2962 transmit solution from Gennum provided all the SD, HD and 3G SDI functionality, eliminating the need for code development, which would have added many more months of design time to the project. Ensemble's new TSG/SPG is fully 3Gb/s compliant and offers programmable outputs including Tri-level sync, HD SDI, SD SDI, 3G, composite, AES and LTC.

"Gennum has led the industry with SDI and HD and is now enabling the industry with its 3G solutions," said Cindy Zuelsdorf, Marketing Czar, of Ensemble Designs. "As we continue to push out 3G product offerings, Gennum's signal integrity expertise is proving to be a critical advantage in delivering quality 3G signaling. Having delivered unparalleled reliability with this product, we can now extend the GS2962's use in additional products across our popular BrightEye family."

Gennum's 'Best in Class' Components Selected for Critical Test Equipment

Leveraging the compact, integrated solution from Gennum, the new TSG/SPG from Ensemble is part of the BrightEye series and is just 143 mm x 40 mm x 140 mm. BrightEye 57's outputs are programmable and offer many signal choices including: Tri-level sync, HD SDI, SD SDI, 3G, composite, AES and LTC. Offering a reference solution for broadcast and post facilities working with 3G signals, the TSG/SPG provides more than 30 selectable test patterns, including bars and pathogenic, which are controlled from the front panel or from PC or Macintosh control software.

Providing the signal integrity and processing functionality within Ensemble's TSG/SPG, Gennum's solution, the GS2962, is a single-chip 3Gb/s transmit offering. Equipped with an integrated VCO and a very narrow loop bandwidth PLL, the GS2962 accepts parallel clock inputs with jitter well in excess of 300ps while outputting an SDI stream with less than 50ps of alignment jitter. Moreover, it features an integrated SMPTE-compliant cable driver. The GS2962 transmitter also offers over 30 percent savings in cost, power, and board area compared to existing HD solutions.

Ensemble's new TSG/SPG will be shown in the Ensemble booth # 8.C90 and in Gennum's booth #10.A29 at IBC this week at the RAI Centre in Amsterdam. In addition, Gennum will be providing a demonstration of its 3Gb/s SDI serial routing & distribution, 3Gb/s SDI optical modules, complete HD & 3Gb/s SDI transmit and receive solutions.

About Gennum's 3Gb/s Portfolio

Gennum is a pioneer in 3Gb/s products, having introduced the industry's first single-chip, transmit and receive solutions for 3Gb/s SDI. With its 3Gb/s transmitters, receivers, reclockers, equalizers and cable driver offerings, Gennum is enabling the world's leading broadcast studios and equipment manufacturers to move to higher rates of high definition content at higher bit depths (12-bit per component) and to provide support for both YCbCr and R'G'B' color sampling.

About Gennum

Gennum Corporation (TSX:GND) designs innovative semiconductor solutions and intellectual property (IP) cores for the world's most advanced consumer connectivity, enterprise, video broadcast and data communications products. Leveraging the company's proven optical, analog and mixed-signal products and IP, Gennum enables multimedia and data communications products to send and receive information without compromising the signal integrity. A recognized award-winner for advances in high definition (HD) broadcasting, Gennum is headquartered in Burlington, Canada, and has global design, research and development and sales offices in Canada, Germany, India, Japan, Korea, Mexico, Taiwan, the United States and the United Kingdom.

Gennum and the Gennum logo are trademarks of Gennum Corporation. All other product or service names are the property of their respective owners. Gennum Corporation, 2008

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