Industry Canada

Industry Canada
Tundra Semiconductor Corporation
TSX : TUN

Tundra Semiconductor Corporation

September 15, 2005 14:01 ET

Government of Canada Invests in Next-Generation Technology

OTTAWA, ONTARIO--(CCNMatthews - Sept. 15, 2005) - The Honourable Mauril Belanger, Minister for Internal Trade and Deputy Leader of the Government in the House of Commons, on behalf of the Honourable David L. Emerson, Minister of Industry, today announced a $7-million investment in the research and development of next-generation systems for wireless infrastructure and networking applications.

This Technology Partnerships Canada (TPC) investment is part of a $28-million project being undertaken by Tundra Semiconductor Corporation of Ottawa to develop switch-fabric-based system interconnect products based on the serial RapidIO interconnect standard.

"The technology being developed has the potential to significantly improve the performance and productivity of a wide range of Canadian industries," said Minister Emerson. "Innovative Canadian SMEs, like Tundra, are making bold advances within the competitive information technology sector, increasing the speed and reliability of communications systems and changing the way we work and communicate."

"Through TPC, we are making an investment in an emerging technology being developed right here in our own backyard," said Minister Belanger. "Tundra is one of Canada's brightest high-tech stars, and this investment builds on their proven track record of innovation and leadership."

The RapidIO Interconnect Architecture is a high-performance interconnect technology designed to be compatible with the most popular integrated communications processors, host processors, networking digital signal processors and bridge chips. It addresses the networking industry's need for reliability, increased bandwidth, faster speeds in intra-system interconnect, and software transparency, at performance levels up to 10 times that of existing technologies.

Through this investment, Tundra Semiconductor Corporation will develop technologies with the performance, power and configurability needed to build reliable, high-speed communications systems. The RapidIO interconnect is primarily designed for networking and communications equipment, enterprise storage, and other high-performance embedded markets.

Technology Partnerships Canada (TPC) is a key instrument for advancing research and development toward commercialization. Working in partnership with innovative companies across Canada, TPC shares in the cost of private sector technology projects in aerospace and defence, in environmental technologies, and in enabling technologies such as information and communications technologies, and biotechnology.



Backgrounder

Tundra Semiconductor Corporation to Expand Portfolio of
RapidIO System Interconnect Products Based on RapidIO Standard


Tundra Semiconductor Corporation will receive a repayable investment of up to $7 million from Technology Partnerships Canada (TPC). This investment is part of a $28-million project.

Tundra's objective for the proposed project is to accelerate the research and development of next-generation RapidIO System Interconnect products, based on the RapidIO standard.

Rapid and seamless connectivity are at the core of a multiplicity of design challenges for next-generation communications and data storage systems. As RapidIO multiplies the rate of information transfer by at least an order of magnitude and improves the quality of the information transferred, multiple point-to-point interconnectivity technology will enable the next generation of high-performance computing systems.

Two families of RapidIO interconnects are currently defined: a parallel interface for high-performance microprocessor and system connectivity, and a serial interface for serial backplane, DSP and associated serial control plane applications. The serial and parallel forms of RapidIO share the same programming models, transactions and addressing mechanisms. The RapidIO interconnect is defined as a layered architecture that allows scalability and future enhancements while maintaining backward compatibility.

The technology transition is a move toward high-speed serial buses, as a replacement for the traditional shared-bus technologies. This transition is driven by the increasing performance capabilities and commensurate increasing bandwidth requirements of semiconductor-based processing devices and by device-level electrical issues that are raised by semiconductor process technologies with feature sizes at 130 nanometres, as well as a move toward the use of standards-based technologies.

Tundra has joined other industry leaders in defining RapidIO as the high-performance embedded interconnect technology standard. These companies represent semiconductor suppliers, embedded systems infrastructure, embedded operating system, IP providers and system OEMs (original equipment manufacturers).

The RapidIO interconnect provides reliability, software transparency and higher bus speeds that allow chip-to-chip and board-to-board communications at performance levels ranging from 1 gigabit per second to 60 gigabits per second. Applications include interconnecting microprocessors, memory and memory-mapped I/O devices in networking equipment, storage subsystems, and general-purpose computing platforms.

Tundra Semiconductor Corporation delivers standards-based System Interconnect for use by the world's leading vendors of wireless infrastructure, networking, storage and pervasive computing systems. Tundra System Interconnect allows customers to link critical system components while compressing development cycles and maximizing performance. Tundra headquarters is located in Ottawa, Ontario, Canada. The company also has a design centre in South Portland, Maine, and sales offices throughout Europe, across the U.S. and in Asia. Tundra sells its products worldwide through a network of direct sales personnel, independent distributors and manufacturers' representatives. Tundra employs approximately 200 employees worldwide, with 111 engaged in research and development. Tundra is publicly traded on the Toronto Stock Exchange under the ticker symbol TUN.

The news release, backgrounder and other documents are available on the Technology Partnerships Canada Web site at www.tpc-ptc.ic.gc.ca.

Contact Information

  • Office of the Honourable David L. Emerson
    Minister of Industry
    Christiane Fox
    (613) 995-9001
    or
    Industry Canada
    Media Relations
    (613) 943-2502