SOURCE: Infineon Technologies North America Corp.

August 22, 2005 09:00 ET

Infineon DRAM Technology Delivers Better Thermal Efficiency, Increased Performance in New Mobile Computing Platforms

SAN FRANCISCO, CA -- (MARKET WIRE) -- August 22, 2005 -- INTEL DEVELOPER FORUM -- Infineon Technologies AG (NYSE: IFX) (FSE: IFX), a leading supplier of memory products, today announced that its Small-Outline Dual-In-Line Memory Modules (SODIMMs) will be used to demonstrate thermal efficiency and performance improvements in next-generation mobile computing platforms at the Intel Developer Forum in San Francisco this week. The Infineon SODIMMs will be used on a new Intel platform featuring DT (Delta Temperature) in SPD (Serial Presence Detect) technology, on display in the Mobile PC Extended Battery Life Community at IDF.

The DT in SPD technology is a smart system feature for managing system power based on the known thermal performance characteristics of components. Tests of the technology indicate that it allows memory modules to operate with up to twice the sustained bandwidth compared to previous generation systems.

Delta Temperature techniques allow Infineon to fully utilize the capabilities of its DRAMs. Infineon DRAM chips are based on trench architecture which uses less power than the typical stack DRAM architecture, which means that Infineon DIMMs run cooler. Because of the improved thermal profile, the clock frequency of systems using Infineon DIMMs is not decreased to meet worst-case requirements, and data transfer rates are maintained. Projections based on testing done by Intel using an Infineon 512MB, 533 MHz SODIMM in an Intel Calistoga mobile computing platform showed a potential increase of up to 30% in sustained bandwidth with DT in SPD compared to a non-DT system.

"Memory power is increasingly important to overall system performance; incorporating DT in SPD is a significant step toward memory thermal improvement for optimal platform performance," said Keith Kressin, director of marketing, Mobile Platform Group, Intel Corporation.

"The efficient thermal performance and corresponding improved power consumption profile of Infineon DRAMs have helped manufacturers of desktop, laptop and server systems to consistently improve performance while simplifying design," said Ulrich Englert, Director of Product Marketing, Memory Products, Infineon Technologies North America. "Intel's implementation of DT in SPD will enable mobile users to choose the most efficient memory for their system requirements and not sacrifice performance."

The Infineon demonstration of its DT-enabled DIMMs will be in booth number 348 in the Mobile PC Extended Battery Life Community at the IDF. Infineon will also be showing other memory products, including its families of FB-DIMMs (fully buffered DIMMs) and VLP-DIMMs (very-low-profile DIMMs), in the Memory Community.

About Infineon

Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for automotive, industrial and multimarket sectors, for applications in communication, as well as memory products. With a global presence, Infineon operates through its subsidiaries in the U.S. from San Jose, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. In fiscal year 2004 (ending September), the company achieved sales of Euro 7.19 billion with about 35,600 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com.

This news release is available at http://www.infineon.com/news

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