Contact Information: For further information: Media: Jeff Ferry Infinera Tel. +1-408-572-5213 jferry@infinera.com Investors: Bob Blair Infinera Tel. +1-408-716-4879 bblair@infinera.com
Infinera Unveils New Passive PIC Platform
Two New Passive PICs Bring New Features, Benefits to 160-Channel System
| Source: Infinera
SUNNYVALE, CA--(Marketwire - June 9, 2008) - Infinera (NASDAQ : INFN ) is introducing two
new passive photonic integrated circuits (PICs) with the launch of its ILS2
line system today. Infinera's passive PICs are designed to deliver benefits
similar to Infinera's existing PICs, including greater density of
functionality in a smaller space, reduced power consumption, simplified
manufacturing, and enhanced reliability. The introduction of these
additional PICs should increase the importance and the value of photonic
integration as a key enabling technology for service providers facing the
growing challenge of meeting escalating bandwidth demand while keeping a
grip on network cost.
Infinera's optoelectronic or "active" PICs will continue to sit at the
heart of Infinera's DTN system. The active PICs, offering 100
Gigabits/second of DWDM capacity on every Infinera line card, have
integrated active devices such as lasers, modulators, and photodiodes.
These active PICs are now in their second generation of development and
include additional functionality not present on the first generation of
active PICs. Future generations of active PICs are planned to scale to
higher capacities and to add additional functionality. In March,
independent analyst firm Heavy Reading labeled Infinera the world leader in
photonic integration technology and estimated Infinera had a four-year lead
over the rest of the industry in photonic integration technology.
Infinera's new passive PICs integrate passive devices such as multiplexers,
interleavers, variable optical attenuators and waveguides, and play key
roles in routing and filtering DWDM wavelengths in the ILS2 system, which
enables up to 160 DWDM channels on a single fiber. [See related news
release,
Infinera Introduces New Line System, Sets New Standard for Capacity for
further information on ILS2.] Infinera's passive PIC technology is based on
the use of a proprietary glass, Hydex®, which enables a reduction in the
size of the planar lightwave circuits (PLCs) on the PICs by roughly 90%
compared to conventional material technologies. Hydex is manufactured at
Infinera's semiconductor fabrication facility in Annapolis Junction,
Maryland, which is also where the passive PICs are produced. Hydex supports
waveguides with far tighter bends than conventional PLCs, enabling dense
integration of devices on Hydex-based PICs, yielding chips far smaller with
significantly more functionality than conventional PLC devices.
More Than 40 Devices on a Chip
Each of these passive PICs is less than one square centimeter in area.
Conventional PLCs typically would require roughly 100 times the area to
perform similar functions. The Infinera passive PICs eliminate more than
90% of the fiber couplings and discrete packages found in non-PIC based
systems, and are designed to deliver significant benefits in network
reliability and simplify manufacturing and test processes, leading to more
time-efficient and cost-efficient production.
One of the passive PICs introduced today is a precision multi-wavelength
multiplexer/ demultiplexer, supporting ILS2's 25 Gigahertz (GHz) channel
spacings. It integrates the functionality of more than 40 devices onto a
single chip. The other passive PIC, announced today serves as a wavelength
management device, integrating the functionality of more than ten devices
on a chip. Both PICs play important roles in enabling the new ILS2 to pack
up to160 channels or wavelengths of light into the C-band while supporting
ultra-long-haul distances.
"This is another important milestone for Infinera and for photonic
integration," commented Sterling Perrin, Senior Analyst at Heavy Reading.
"The company established itself as the world leader in photonic integration
with its initial PIC pair, launched in 2004. In 2008, the company is
proving that it continues to lead in PIC innovation -- first with its
active PIC roadmap announced earlier in the year and now with its new
passive PICs."
"Infinera believes that integration is the only known technology that can
improve the capacity of a network while simultaneously delivering benefits
in terms of cost per bit, reliability, scalability, speed of operation,
density, and power consumption," commented Infinera Chief Marketing and
Strategy Officer Dave Welch. "Our passive PICs, based on a different
platform from our active PICs, demonstrate that PIC technology can be
applied to multiple materials, and to multiple points in the design of an
optical network. We believe that photonic integration is still at a
relatively early stage in its life as a key technology for optics."
About Infinera
Infinera provides Digital Optical Networking systems to telecommunications
carriers worldwide. Infinera's systems are unique in their use of a
breakthrough semiconductor technology: the photonic integrated circuit
(PIC). Infinera's systems and PIC technology are designed to provide
optical networks with simpler and more flexible engineering and operations,
faster time-to-service, and the ability to rapidly deliver differentiated
services without reengineering their optical infrastructure. For more
information, please visit www.infinera.com.
This press release contains certain forward-looking statements based on
current expectations, forecasts and assumptions that involve risks and
uncertainties. These statements are based on information available to
Infinera as of the date hereof; and actual results could differ materially
from those stated or implied, due to risks and uncertainties.
Forward-looking statements include statements regarding Infinera's
expectations, beliefs, intentions or strategies regarding the future which
includes Infinera's belief that the introduction of additional PICs
increases the importance and the value of photonic integration as a key
enabling technology for service providers; that passive PICs deliver
significant benefits in network reliability and simplify manufacturing and
test processes, leading to more efficient production; that ILS2's 25
Gigahertz (GHz) channel spacings is industry-leading; and that Integration
is the most powerful technology direction in optical networks today and the
only known technology that can improve the capacity of a network while
simultaneously delivering benefits in terms of cost per bit, reliability,
scalability, speed of operation, density, and power consumption. Such
forward-looking statements can be identified by forward-looking words such
as "anticipated," "believed," "could," "estimate," "expect," "intend,"
"may," "should," "will," and "would" or similar words. The risks and
uncertainties that could cause our results to differ materially from those
expressed or implied by such forward-looking statements include aggressive
business tactics by our competitors, our dependence on a single product,
our ability to protect our intellectual property, claims by others that we
infringe their intellectual property, our manufacturing process is very
complex, product performance problems we may encounter, our dependence on
sole or limited source suppliers, our ability to respond to rapid
technological changes, our ability to maintain effective internal controls,
the ability of our contract manufacturers to perform as we expect, a new
technology being developed that replaces the PIC as the dominant technology
in optical networks, general political, economic and market conditions and
events, including war, conflict or acts of terrorism; and other risks and
uncertainties described more fully in our annual report on Form 10-K filed
with the Securities and Exchange Commission on February 19, 2008, our
public announcements and other documents filed with or furnished to the
Securities and Exchange Commission. These statements are based on
information available to us as of the date hereof and we disclaim any
obligation to update the forward-looking statements included in this press
release, whether as a result of new information, future events or
otherwise.