SOURCE: Inphi Corporation

Inphi Corporation

February 05, 2013 08:00 ET

Inphi to Present on Next-Generation 100G Interconnects for Cloud and Data Center Applications at the Linley Tech Data Center Conference 2013

SANTA CLARA, CA--(Marketwire - Feb 5, 2013) - Inphi Corporation (NYSE: IPHI), a leading provider of high-speed mixed signal semiconductor solutions for the communications and computing markets, today announced its participation at the Linley Tech Data Center Conference 2013. The conference, being held on February 5-6, 2013 at the Hyatt Regency Hotel in Santa Clara, CA, will include leading companies discussing the latest products and technologies focused on the processors, components and interconnects for data center networking and servers.

Presentation: Cloud Computing, Software Defined Networking and the Need for 100G Interconnects in Data Centers
Speaker: Siddharth Sheth, Vice President of Marketing for Inphi's High-speed Connectivity Products
When: February 6, 2013 from 10:00-12:00 p.m. PT
Where: Hyatt Regency Hotel, Santa Clara, CA

For more information about the Linley Tech Data Center Conference, please visit www.linleygroup.com/events/index.php.

About Inphi
Inphi Corporation is a leading provider of high-speed mixed signal semiconductor solutions for the communications and computing markets. Inphi's end-to-end data transport platform delivers high signal integrity at leading-edge data speeds, addressing performance and bandwidth bottlenecks in networks, from fiber to memory. Inphi's solutions minimize latency in computing environments and enable the rollout of next-generation communications infrastructure. Inphi's solutions provide a vital interface between analog signals and digital information in high-performance systems, such as telecommunications transport systems, enterprise networking equipment, enterprise and data center servers, and storage platforms. To learn more about Inphi, visit www.inphi.com.

Inphi, the Inphi logo and Think fast are registered trademarks of Inphi Corporation. All other trademarks used herein are the property of their respective owners.

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