SOURCE: Carsem, Inc.

April 07, 2005 09:30 ET

International Trade Commission Extends Target Date

SCOTTS VALLEY, CA -- (MARKET WIRE) -- April 7, 2005 -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that the International Trade Commission (ITC) recently issued a notice that they have remanded the investigation to the presiding Administrative Law Judge (ALJ) for further proceedings and findings in light of claim construction determinations made by the Commission and an expected ruling by the U.S. Court of Appeals for the District of Columbia (D.C. Court of Appeals) in U.S. International Trade Commission vs. ASAT Inc. The ITC has extended the target date in this investigation to November 21, 2005.

On November 17, 2003 Amkor filed a complaint with the ITC accusing Carsem of infringing claims in three of Amkor's United States Patents. On November 18, 2004 the ALJ issued an Initial Determination (ID) that Amkor's asserted claims were invalid, not infringed or both, and that no violation of Section 337 of the Tariff Act of 1930 occurred. On February 1, 2005 the ITC determined to review the ID in its entirety and having reviewed the record the Commission has determined to make various claim construction determinations with regard to the patent claims under review and to remand the investigation to the ALJ for additional proceedings and findings in light of those claim constructions. The Commission has also directed the ALJ to reopen the evidentiary record to receive, and make findings based on, evidence that may become available after the D.C. Court of Appeals rules in U.S. International Trade Commission v. ASAT, Inc.

David Comley, Carsem's Group Managing Director, stated, "We are pleased the Commission decided to reopen the evidentiary record to receive additional relevant evidence we expect to result from enforcement of the ITC's subpoena to ASAT. We feel that the claim construction determinations made by the Commission support the ALJ's initial determination in favor of Carsem, and that combined with the additional relevant evidence from ASAT that may become available, will further support a final determination in Carsem's favor."

About Carsem

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.

Contact Information

  • Press Contact:
    Paul Smith
    Director of Marketing
    Telephone Number: 831 438-6861
    Fax Number: 831 438-6863
    Email Address: psmith@carsem.com
    Web site address: www.carsem.com