SOURCE: Intersil

Intersil

November 08, 2010 12:59 ET

Intersil's Breakthrough ISL8200MM Power Module Now Ready for Defense Applications

High Component Integration Simplifies Designs, Complies With Thermal, Electrical Requirements for Radar, Sonar and Avionics Systems Under DSCC VID V62/10608

MILPITAS, CA--(Marketwire - November 8, 2010) -  Intersil Corporation (NASDAQ: ISIL) today introduced a version of its popular breakthrough ISL8200M DC/DC power module designed for defense, harsh environment and avionics applications.

The ISL8200MM point-of-load DC/DC power module complies with specifications of the Defense Supply Center (DSCC) VID V62/10608. It provides a complete switch-mode power supply in a single package with full mil-temp electrical performance from -55°C to +125°C and is built using a tin-lead finish to assure optimal long-term reliability. Full traceability is provided through assembly and test by date/trace code assignment, and Intersil provides enhanced process change notification. Combined with parallel load current scalability and extended leads on its QFN package, the ISL8200MM is ideal for defense communications equipment, radar, sonar, defense ground vehicles and smart ordinance applications.

The ISL8200MM uses Intersil's patented current share architecture to reduce PCB layout noise sensitivity when modules are used in parallel. The device incorporates almost all of the components required to deliver a plug-and-play solution, replacing as many as 40 different components. This high level of integration simplifies and speeds designs while reducing the power management footprint. 

A thermally efficient 23-lead, 15mm x 15mm QFN package with large conductive pads on the bottom enables output power levels up to 60W. Internal high power components such as power MOSFETs and inductors are soldered directly to the conductive pads, enabling efficient heat transfer from the module to the PCB. Using thermal vias on the PCB results in a typical thermal resistance (theta JA) of only 13°C/W. Because most heat transfer is through the PCB, airflow is generally not required.

The module's QFN package has exposed leads around its perimeter, which allows access to pins for debug and solder joint verification. The ISL8200MM's very low 2.2mm profile allows it to be mounted to the bottom side of the PCB with other low-profile components.

Pricing and Availability 
The defense-specified ISL8200MM is available now with prices starting at $39.23 each in 1,000-piece units. For more information please visit: http://www.intersil.com/products/deviceinfo.asp?pn=ISL8200MMREP

To view a high-resolution downloadable photo, please visit Intersil's photo room at:
http://www.intersil.com/pressroom/hr_photos/20101108_ISL8200MMREP_hr.jpg.

About Intersil
Intersil Corporation is a leader in the design and manufacture of high-performance analog, mixed signal and power management semiconductors. The Company's products address some of the fastest growing markets within the communications, computing, consumer and industrial industries. For more information about Intersil or to find out how to become a member of our winning team, visit the Company's web site and career page at www.intersil.com.

Intersil and the Intersil logo are trademarks or registered trademarks of Intersil Corporation. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners.