SOURCE: Intersil

September 18, 2009 13:31 ET

Intersil's ISL8201M Power Module Garners "Top Ten" Award From Major Asian Electronics Magazine

Editors Recognize Breakthrough Design and Superior Performance of Innovative DC/DC Power Module for Applications in Networking, Communications and Instrumentation

MILPITAS, CA--(Marketwire - September 18, 2009) - Intersil Corporation (NASDAQ: ISIL), a world leader in the design and manufacture of high-performance analog and mixed-signal semiconductors, announced that its ISL8201M Power Conversion Module has been selected as a "Top Ten" winner in the Annual DC:DC Power Product Awards by the Editors of Electronic Products China Magazine. The award will be formally announced in a ceremony today at the 2009 Power Technology Conference in Beijing, in the October 2009 issue of Electronic Products China and

The ISL8201M is a high-efficiency, low-noise, highly integrated DC/DC power module solution in a thermally enhanced QFN package. Included in the package is a high-performance PWM controller capable of switching at 600kHz, power MOSFETs, power inductor, and all the passive components required for a complete DC/DC power solution. The ISL8201M simplifies power supply design as only minimal external components are needed to implement a complete power solution.

This small form factor saves considerable board space while the high integration reduces procurement and placement costs in various applications such as telecommunications, data communications, electronic data processing, wireless network systems, medical and instrumentation, and point-of-load applications based on a distributed-bus architecture.

The ISL8201M is capable of delivering 10A (17A peak) output current with up to 95% efficiency, without the need for heat sinks or airflow to meet power specifications. Other features include internal compensation, internal soft-start, auto-recovery overcurrent protection, enable control, and pre-biased output start-up capability.

The highly integrated ISL8201M is housed in a tiny 15mm x 15mm x 3.5mm QFN package that is designed to offer optimum heat transfer through the PCB for excellent thermal performance. A large copper plate under the package allows the ISL8201M to achieve a power density of approximately 200W/in3, roughly four times that of conventional open-frame modules, thereby eliminating the need for heat sinks.

To view a high-resolution downloadable photo of the ISL8201M, visit Intersil's photo room at:

About Intersil

Intersil Corporation is a leader in the design and manufacture of high-performance analog and mixed signal semiconductors. The Company's products address some of the industry's fastest growing markets, such as flat panel displays, cell phones, notebooks and other handheld systems. Intersil's product families address power management functions and analog signal processing functions. Intersil products include ICs for battery management, hot-plug controllers, linear regulators, power sequencers, supervisory ICs, bridge drivers, PWM controllers, switching DC/DC regulators, Zilker Labs Digital Power ICs and power MOSFET drivers; optical storage laser diode drivers; DSL line drivers; D2Audio products; video and high-performance operational amplifiers; high-speed data converters; interface ICs; analog switches and multiplexers; crosspoint switches; voice-over-IP devices; and ICs for military, space and radiation-hardened applications. For more information about Intersil or to find out how to become a member of our winning team, visit the Company's web site and career page at