SOURCE: Intrinsyc Technologies Corporation

Intrinsyc Technologies Corporation

December 15, 2015 09:00 ET

Intrinsyc Announces Development Platforms Featuring New High-Performance Qualcomm Snapdragon 820 Processor

New Platforms to Accelerate Development of Mobile Devices and Applications

VANCOUVER, BC--(Marketwired - December 15, 2015) - Intrinsyc Technologies Corporation (TSX: ITC) (OTC: ISYRF) ("Intrinsyc"), a leading developer of intelligent connected devices, today announced the general availability of new development platforms featuring the Qualcomm® Snapdragon™ 820 processor, a product of Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated. The Snapdragon 820 has been holistically designed to enrich visual quality and audio clarity, as well as develop new intuitive ways to interact with devices to generate deeply immersive experiences.

To support the ecosystem of technology companies and application providers looking to utilize the advanced features of the Snapdragon 820, Intrinsyc Technologies Corporation is introducing new development platforms, including two new Mobile Development Platforms ("MDP"); one in a tablet form factor and the other in a smartphone form factor; and a new Open-Q™ 820 development kit.

The next-generation MDP is designed to provide application developers with the most feature rich, performance-enhanced Android™ platform for developing, testing, optimizing and showcasing applications and games. Incorporating the Snapdragon 820 processor, this newest MDP features Qualcomm Technologies' Qualcomm® Adreno™ 530 GPU, its new custom 64-bit Qualcomm Kryo™ CPU, its latest Qualcomm® Hexagon™ 680 DSP and its new 14-bit Qualcomm Spectra™ image signal processing (ISP) unit, designed to support superior DSLR-quality photography and enhanced computer vision. The MDP is an essential tool for application developers and other industry participants, featuring integrated hardware and software which aids in simplifying and accelerating development efforts. In addition, the MDP provides users the ability to test and optimize applications and devices prior to commercial device deployment.

The smartphone form factor MDP features a 6.2" Quad HD display with an incredible 490 pixels per inch, while the tablet form factor version features a 10.1" Ultra HD 4K (3840 × 2160 resolution) multi-touch display. Both MDPs support superior Wi-Fi performance and connectivity experiences through Qualcomm VIVE™ 802.11ac with Qualcomm MU | EFX MU-MIMO technology, integrated support for Bluetooth® 4.1, USB 3.0 and Qualcomm IZat™ location services for ubiquitous and highly accurate location services. Qualcomm VIVE, Qualcomm MU | EFX and Qualcomm IZat are products of Qualcomm Atheros, Inc., a subsidiary of Qualcomm Incorporated. The MDP tablet also has tri-band support, through multi-gigabit 802.11ad (11ad) Wi-Fi.

The MDP also runs the Android 6.0 operating system and pre-installed power and performance profiling software called Trepn™ Profiler. This software is designed to make it easy to locate and resolve performance bottlenecks so applications can perform at peak levels.

The Open-Q 820 Development Kit is an open-frame solution that empowers the technology community to integrate and innovate for devices based on the latest Snapdragon processor, as well as provide original equipment manufacturers ("OEMs"), developers and engineers with next generation software technology and tools to accelerate development and testing of devices. The Open-Q 820 Development Kit includes all of the software tools and accessories required to immediately begin development work. It is a full featured Android development platform that provides an ideal starting point for creating high-performance connected devices and applications.

The new Open-Q 820 Development Kit Specifications are:

  • Snapdragon 820 processor with 64-bit Kryo CPU, Adreno 530 GPU, and Hexagon 680 DSP
  • System Memory - 3GB LPDDR4 RAM
  • Storage - 32GB UFS V2.0 flash
  • Connectivity:
    • Wi-Fi® 802.11n/ac
    • Bluetooth 3.0/4.1
    • GNSS (GPS and GLONASS)
  • I/O Interfaces:
    • 1x USB 3.0 micro-AB + 2x USB 2.0 + 1x USB 2.0 micro-AB
    • HDMI output
    • 1x MIPI dual 4-lane DSI + touch panel
    • 3x MIPI CSI with support for 3D camera configuration
    • 2x SATA
    • 1x PCI Express Slot and 1x Mini-PC Express socket
    • 1 MicroSD card slot
    • 4x Expansion headers for additional features (NFC, sensors etc.)
    • ANC 3.5mm audio jack
    • Audio input and output expansion headers

"We are very excited to offer early access to these comprehensive development tools, allowing developers and connected device makers to accelerate their product development using the powerful and efficient Snapdragon 820," said Victor Gonzalez, Vice President, Engineering, Intrinsyc. "The MDP is extremely beneficial for any developer looking to create and demonstrate applications running on the latest and most advanced Snapdragon technology available and the Open-Q 820 is a comprehensive development platform that is a great starting point for companies building high-performance devices"

For both the MDP and Open-Q 820, users will receive product documentation and access to complimentary tools and software updates, and additional technical support or product development assistance through Intrinsyc's technical support services. The MDP and Open-Q 820 Development Kit are offered for purchase at http://shop.intrinsyc.com. The Open-Q 820 Development Kit can be ordered now and the MDP will be available for order by December 31, 2015. Developers can also find tools to optimize their apps for Snapdragon processors at https://developer.qualcomm.com.

The Snapdragon 820 is engineered with custom-built, highly optimized cores designed for heterogeneous computing -- the ability to combine different functional cores of the system-on-chip (SoC), like the CPU, GPU, and DSP cores, to achieve performance and power savings. The Snapdragon 820 is being manufactured on the latest 14nm FinFET technology.

The new Adreno 530 GPU architecture delivers up to 40 percent improvement in graphics over the previous generation to enable stunning high-definition graphics, while the new Kryo CPU offers up to twice the power efficiency. In addition, Snapdragon 820 will also debut the new 14-bit Qualcomm Spectra image signal processing (ISP) unit, which can capture up to 25 megapixels with zero shutter lag and is designed to support superior DSLR-quality photography and enhanced computer vision.

All of these elements combined now enable a user experience, level of innovation, and efficiency that defines Snapdragon 820 as the most innovative premium-tier mobile processor Qualcomm Technologies has ever built. Due to its ability to sustain high performance at low power, the Snapdragon 820 is also an excellent choice for adjacent commercial products like automotive and other embedded devices. 

About Intrinsyc Technologies Corporation

Intrinsyc Technologies is a product development company that provides comprehensive and tailored solutions that enable the development and production of next-generation intelligent connected devices. Solutions span the product development life cycle from concept to production and help makers of intelligent connected devices create compelling differentiated products with faster time-to-market. Intrinsyc is publicly traded (TSX: ITC) (OTC: ISYRF) and is headquartered in Vancouver, BC, Canada. See www.intrinsyc.com for more information.

Intrinsyc and Open-Q are trademarks of Intrinsyc Technologies Corporation. Qualcomm, Snapdragon, Adreno, Trepn, Hexagon, and VIVE are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, IZat, and Qualcomm Spectra are trademarks of Qualcomm Incorporated. Qualcomm Spectra, Qualcomm Kryo, Qualcomm Snapdragon, Qualcomm Adreno, Trepn and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm VIVE, Qualcomm MU | EFX and Qualcomm IZat are products of Qualcomm Atheros, Inc. All Qualcomm Incorporated trademarks are used with permission. Bluetooth is a registered trademark of Bluetooth SIG, Inc. Wi-Fi is a registered trademark of the Wi-Fi Alliance. Other products or brand names may be trademarks or registered trademarks of their respective owners.

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Contact Information

  • For more information, please contact:

    Victor Gonzales
    Vice President, Engineering
    Intrinsyc Technologies Corporation
    Email: vgonzales@intrinsyc.com
    Phone: +1-604-801-6461