SOURCE: Intrinsyc Technologies Corporation

Intrinsyc Technologies Corporation

August 30, 2017 09:00 ET

Intrinsyc Announces Open-Q™ 626 System on Module ("SOM") and Development Kit

Ideal for Powering Next-Generation Connected Cameras and Other Embedded and IoT Devices

VANCOUVER, BC--(Marketwired - August 30, 2017) - Intrinsyc Technologies Corporation (TSX: ITC) (OTC: ISYRF) ("Intrinsyc" or the "Company"), a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the availability of the Open-Q™ 626 System on Module (SOM) and Development Kit.

Intrinsyc's Open-Q™ 626 System on Module (SOM) is an ultra-compact (50mm x 25mm) production-ready SOM that is ideal for powering next-generation connected cameras, and other IoT devices. The feature-rich SOM with its advanced processor technology supports premium 4K video with HEVC capture and playback for optimal balance of quality and bandwidth. It offers professional camera features, including: improved dynamic range, enhanced Autofocus performance and computational photography. The SOM offers battery-efficient enhancements to audio, video, and computer vision use cases, PC-class graphics with support for advanced APIs and Hardware Tessellation and enables new always-on use cases at reduced power levels and cost.

"Intrinsyc's Open-Q™ SOMs provide a flexible way to rapidly bring IoT devices to market with reduced risk; combining the time-to-market benefits of an off-the-shelf product, with the flexibility and optimization of a custom design," said Cliff Morton, Vice President, Solutions Engineering, Intrinsyc. "Our latest System on Module, the Open-Q™ 626, is ready for production use and will expand opportunities in a variety of connected camera and other embedded and IoT products."

Open-Q™ 626 SOM Specifications

Processor

  • 64-bit Octa-Core ARM Cortex A53, up to 2.2GHz, 14nm technology
  • GPU supports OpenGL ES 3.1, OpenCL 2.0 Full, DirectX 12, GPU Tessellation, Geometry Shading
  • Integrated DSP

Memory/Storage

  • 2GB LPDDR3 RAM
  • 16GB eMMC Flash

Wireless

  • Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz with 5Ghz external PA & U.FL antenna connector
  • Bluetooth 4.2 + BLE

Location Services

  • GPS, GLONASS, Compass with U.FL antenna connector

LCD/Touchscreen Interface

  • 2x 4-lane MIPI DSI
  • LCD up to 1080P

Camera Interface

  • Up to 24MP with 3x 4-lane MIPI CSI and dual ISPs (additional software may be required)

Video

  • Video Capture up to 4K Ultra HD at 30fps
  • Video Playback 4K Ultra HD
  • H.264 (AVC) and H.265 (HEVC)

Audio

  • Integrated audio codec
  • 1x Stereo headset jack with mic
  • 1x mono speaker
  • 1x mono earpiece output
  • 3x mic inputs
  • 1x stereo digital mic input
  • 2x I2S buses

I/O

  • 1x USB3.0 Type-C, multiple BLSP ports (GPIO, UART, SPI, I2C buses), Haptics output, 4-bit SDIO interface, LED driver outputs

OS Support

  • Android 7.1

Operating Environment

  • Input 3.6V to 4.2V
  • Operating Temperature -10°C to +70°C
  • 3x 100 pin board to board connectors
  • 50mm x 25mm

Additional information is available at: https://www.intrinsyc.com/system-on-modules/

To enable rapid development of devices using the Open-Q™ 626 SOM, Intrinsyc provides a full-featured development platform including the software tools and accessories required to immediately begin development. The development kit marries the production-ready Open‐Q™ 626 SOM with a carrier board providing numerous expansion and connectivity options to support the development and testing of a wide variety of peripherals and applications, ensuring the fastest time to market possible. The Development Kit is available for purchase at http://shop.intrinsyc.com/collections/product-development-kits.

In addition to the Open-Q™ 626 SOM and Development Kit, Intrinsyc offers a full range of development kits and production-ready computing platforms, turnkey product development, and production of custom embedded computing platforms. Contact Intrinsyc at sales@Intrinsyc.com with your product requirements and have one of the Company's Solution Architects help plan for your successful product development and launch.

About Intrinsyc Technologies Corporation
Intrinsyc Technologies Corporation is a product development company that provides hardware, software, and engineering and production services that enable rapid commercialization of embedded and Internet of Things (IoT) products. Solutions span the development life cycle from concept to production and help device makers and technology suppliers create compelling differentiated products with faster time-to-market. Intrinsyc's Open-Q™ System on Modules incorporate the industry's most advanced processor technology and help OEMs to rapidly bring industry leading products, with rich functionality and high performance, to market . Intrinsyc is publicly traded (TSX: ITC) (OTC: ISYRF) and is headquartered in Vancouver, BC, Canada.

Intrinsyc and Open-Q and their respective logos are trademarks, registered and otherwise, of Intrinsyc Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

© Intrinsyc Technologies Corporation all rights reserved.

Image Available: http://www.marketwire.com/library/MwGo/2017/8/29/11G144778/Images/626-Side-WithShadow-b878d9251486aabe96d1a873919b76d8.jpg
Image Available: http://www.marketwire.com/library/MwGo/2017/8/29/11G144778/Images/626SOM-Side-WithShadow-5cb5d3e66d26b3be8bfe3de3d65dbd42.jpg

Contact Information

  • For more information, please contact:

    Rachele Webb
    Senior Marketing Communications Coordinator
    Intrinsyc Technologies Corporation
    Email: rwebb@intrinsyc.com