SOURCE: Johnstech International
MINNEAPOLIS, MN--(Marketwired - Mar 11, 2014) - Johnstech International announced today the launch of IQtouch™ Micro Wafer Level Test probe arrays, designed to serve semiconductor manufacturers' device migration toward Wafer Level Chip Scale Packaging (WLCSP). This emerging and performance-enhancing semiconductor packaging has largely enabled the rapid growth of industry-leading mobile products like smartphones and tablets.
"The extraordinary growth in the mobile market, especially the emergence of wearables, will continue to create opportunities for our customers to incorporate new semiconductor devices into all aspects of our daily lives," said Dan Campion, Business Unit Director for Johnstech's new Probe & Engineering Services Business Unit. "After extensive product development efforts, we are excited to be launching the first IQtouch™ product that will enhance our customers' WLCSP test capabilities at reduced interconnect pitches." He also added that his group's focus is on continuing development of productivity-enhancing wafer level test technologies that enable customers' mobile market roadmaps with a speed-to-market emphasis that is critical to their success in today's fast-moving environment.
The mobile market is rapidly driving semiconductor device requirements toward smaller and cheaper, but at the same time no less capable. This is an extremely challenging combination for semiconductor manufacturers and reflects their need for higher performing solutions that are still cost-effective.
"Our customers' test results so far have been fantastic," says Mark Menzuber, Senior Product Manager for Johnstech. "With a groundbreaking new technology like IQtouch™ Micro, we have successfully integrated our final test application expertise with the latest techniques in design engineering and precision manufacturing. Going below 400 microns has always been challenging for traditional test solutions in the market. But with our new technologies we are well-positioned for the future demands of our customers' WLCSP roadmaps."
Johnstech International Corporation is a leader in high performance Wafer & Package Final Test solutions for the global semiconductor industry, with particular expertise in RF/Microwave, Precision Analog, High Speed Digital and Mixed Signal applications. The company's patented technologies were first introduced to the market in 1992. Johnstech helps test engineers and product engineers reduce risk, shorten development and test time and improve first pass yields. Johnstech also provides test floor, electrical modeling, thermal modeling and load board / probe card optimization services. Johnstech is headquartered in Minneapolis, Minnesota, with worldwide sales and solutions offices in California, Japan, Singapore, Beijing, and the Philippines. For more information, visit www.johnstech.com.