SANTA CLARA, CA--(Marketwired - April 13, 2015) - Join Mobiveil CEO Ravi Thummarukudy at the Ethernet Technology Summit in the Santa Clara Convention Center, Tuesday April 16, from 4:00 to 5:00 PM to learn how Mobiveil breaks bottlenecks in high speed interface design.
What: The Ethernet Technology Summit showcases open Ethernet delivering high-performance, low-cost, open-standard; open source switching; Ethernet and the Internet of Things; and high-speed interfaces.
Who: Ravi Thummarukudy, CEO of Mobiveil, Inc and Chair of RapidIO Marketing Working Group will participate on the panel "What Are The Keys to High-Speed Interface Design Today?" Session H-15 in the High-Speed Interfaces Seminar, Chaired by Scott Feller, Associate VP Product Marketing, Inphi.
Why: Mobiveil's High Speed Serial Interconnect family of IP solutions enable highest performance risk-free, easy to integrate, silicon proven IP and platforms for developing next generation products and applications for the networking, storage and enterprise markets.
Who should attend: SoC and ASIC chip architects, designers, and verification engineers.
When: 4:00 - 5:00 PM. Tuesday, April 14th - Preconference Seminars.
Where: Santa Clara Convention Center 4200 Great America Parkway Santa Clara, California 95054 USA.
Mobiveil is a fast‐growing technology company that specializes in development of Silicon Intellectual Properties, platforms and solutions for the networking, storage and enterprise markets. Mobiveil team leverages decades of experience in delivering high‐quality, production‐proven, high-speed serial interconnect Silicon IP cores and custom and standard form factor hardware boards to leading customers worldwide. Mobiveil is headquartered in the Silicon Valley with engineering development centers located in Milpitas, CA, Chennai and Bangalore, India, and sales offices and representatives located in the US, Europe, Israel, Japan, Taiwan and People's Republic of China. For more information, please visit http://www.mobiveil.com