Kandou to Introduce Technique for Increasing the Bandwidth of a Multi-Drop Bus at DesignCon 2016

MDC Signaling Provides 2X or More Bandwidth Improvement Over Single-Ended and Differential Signaling


LAUSANNE, SWITZERLAND--(Marketwired - January 14, 2016) - Kandou Bus will present a paper at DesignCon 2016 that will propose a method for increasing the useful channel spectrum in a multi-drop bus. In a presentation by Ali Hormati, Research Engineer, Kandou will introduce a signaling scheme that delivers significantly more bandwidth than conventional single-ended and differential methods.

"Traditionally, capacity on a multi-drop channel has been limited by reflections that attenuate the main signal," said Amin Shokrollahi, CEO and Founder of Kandou Bus. "MDC Signaling enables the transmission to jump over this notch and take greater advantage of the total frequency spectrum."

MDC Signaling™ Offers Significant System-level Architectural Advantages

Multi-Drop Chord Signaling ™ ("MDC Signaling") was architected to address the need for growing bandwidth in NAND-based SSD systems where a controller must communicate with many NAND die, or in DDRx multidrop architectures. The increased capacity offered by MDC Signaling allows system architects and chip designers to contemplate systems with much higher NAND or DDRx capacity.

MDC is based on a unique concept whereby the spectrum of a transmitted signal is shaped to match the frequency response of the given channel. Since the signal spectrum now has a notch at a similar frequency to the channel, the useful channel spectrum after the notch can be used advantageously. MDC can be combined with other existing signaling techniques like single-ended, differential and Chord Signaling™ to further improve signal integrity and lower power.

DesignCon Details

On Wednesday morning, January 20th, Kandou Research Engineer Ali Hormati will present the Kandou paper entitled, "A Versatile Spectrum Shaping Scheme for Communicating Beyond Notches in Multi-Drop Interfaces" as a part of Track 10 of the conference.

The complete DesignCon 2016 program can be found at http://www.designcon.com.

About Kandou Bus S.A.

Bandwidth and power challenges for next-generation links are being addressed by the industry's leading standards organizations such as OIF, IEEE and JEDEC. Kandou advocates for industry standards, contributing its technology and support via membership and board positions within these organizations. 

Headquartered in Lausanne, Switzerland and founded in 2011, Kandou Bus is an innovative interface technology company specializing in the the invention, design, license and implementation of unmatched chip-to-chip link solutions. Kandou's Chord Signaling™ technology lowers power consumption and improves overall performance of semiconductors, unlocking new capabilities in electronic devices and systems. http://www.kandou.com.

Chord Signaling is a trademark of Kandou Bus. All other trademarks or registered trademarks are properties of their respective owners.

Contact Information:

Press Contact:
Jeff McGuire
VP Business Development
303-903-9244
jeff@kandou.com