SOURCE: Kandou Bus

Kandou Bus

January 13, 2016 07:00 ET

Kandou to Present Alternative for 56G and Beyond Backplane Interconnect at DesignCon 2016

ENRZ Signaling Provides Excellent Eye Opening Over High Loss Channels

LAUSANNE, SWITZERLAND--(Marketwired - January 13, 2016) - Kandou Bus will present a paper at DesignCon 2016 that will compare the sensitivity of PAM4 and Ensemble NRZ ("ENRZ") to inter-symbol interference ("ISI"). In a presentation by Ali Hormati, Research Engineer, Kandou will address why PAM4 is highly susceptible to ISI and how ENRZ 4-wire signaling exhibits the same tolerance to ISI as NRZ differential signaling while delivering a higher bandwidth link. 

"The bandwidth requirements for backplane internconnects continue to increase exponentially," said Amin Shokrollahi, CEO and Founder of Kandou Bus. "PAM4 is capable of higher bandwidth than traditional NRZ signaling, but PAM4's inherently high ISI make it fragile. Its applications often require heavy forward error correction, many DFE taps and other equalization techniques that each come at the expense of power and area. Kandou's ENRZ is ideal for future backplanes because it delivers high bandwidth and low power with excellent signal integrity." 

ENRZ Chord Signaling™ Offers Significant System-level Architectural Advantages

The center of Kandou's ENRZ technology is a chordal code that delivers three bits over four correlated wires within each clock cycle. Although signals are introduced on the wires at four different levels, much like PAM4, a simple yet elegant comparator network receives and translates the bits into three binary, NRZ-shaped eyes. The result is a signaling method that delivers 50 percent more bandwidth than NRZ without the ISI penalty of PAM4.

Kandou has architected a backplane solution that can deliver 84Gbps over four wires for up to one meter of backplane with insertion loss of up to 35dB and manufactured in a 28nm process. Further research indicates the possibility for up to 448Gbps over four wires in advanced process nodes when combined with other signaling methods.

Other applications of Chord Signaling range from ultra-short reach connections ideal for 2.5D packaging to interfaces to stacked memory, standard memory interfaces like LPDDR and DDR, and SerDes links for chip-to-chip communications on PCBs. Chord Signaling is easily adaptable to the unique requirements of virtually any chip-to-chip interface.

DesignCon Details

On Wednesday afternoon, January 20th, Kandou Research Engineer Ali Hormati will present the Kandou paper entitled, "ISI Tolerant Signaling: A Comparative Study of PAM4 and ENRZ" as a part of Track 10 of the conference.

The complete DesignCon 2016 program can be found at http://www.designcon.com.

About Kandou Bus S.A.

Bandwidth and power challenges for next-generation links are being addressed by the industry's leading standards organizations such as OIF, IEEE and JEDEC. Kandou advocates for industry standards, contributing its technology and support via membership and board positions within these organizations.

Headquartered in Lausanne, Switzerland and founded in 2011, Kandou Bus is an innovative interface technology company specializing in the the invention, design, license and implementation of unmatched chip-to-chip link solutions. Kandou's Chord Signaling™ technology lowers power consumption and improves overall performance of semiconductors, unlocking new capabilities in electronic devices and systems. http://www.kandou.com.

Chord Signaling is a trademark of Kandou Bus. All other trademarks or registered trademarks are properties of their respective owners.

Contact Information

  • Press Contact:
    Jeff McGuire
    VP Business Development
    303-903-9244
    jeff@kandou.com