SOURCE: Kulicke & Soffa

June 06, 2005 11:09 ET

Kulicke & Soffa Provides New Date for Its "Semiconductor Industry Trends" Conference Call

WILLOW GROVE, PA -- (MARKET WIRE) -- June 6, 2005 -- Kulicke & Soffa Industries Inc. (NASDAQ: KLIC) today provided a new date for its "Semiconductor Industry Trends" conference call to offer a perspective on the industry and discuss pertinent aspects of the Company's performance. The call has been rescheduled for June 15, 2005.


K&S "Semiconductor Industry Trends" Conference Call. C. Scott Kulicke, chairman and chief executive officer, will host the call. Maurice Carson, vice president and chief financial officer, and Michael J. Sheaffer, director of media and shareholder activities, will also be present.

New Date & Time:

June 15, 2005 at 9:00 am ET

Attend by Telephone:

Analysts and investors are invited to participate by calling toll free 877-407-8037 or internationally 201-689-8037 approximately 15 minutes prior to the call start time and an operator will connect you to the conference call.

Listen on the Internet:

For listen-only mode of the live conference call, log on to

Replay Information:

A Webcast replay will be available on the K&S web site at

A digital replay will be available approximately one hour after the conclusion of the call until July 15, 2005 by calling toll free: 877-660-6853 or internationally: 201-612-7415. Please use the following access codes: account number 5521 and conference number 156636.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is the world's leading supplier of semiconductor wire bonding assembly equipment. We believe K&S is the only major supplier to the semiconductor assembly industry that provides customers with semiconductor wire bonding equipment along with the complementing packaging materials and test interconnect products that actually contact the surface of the customer's semiconductor devices. The ability to control all of these assembly related products is unique to Kulicke & Soffa, and allows us to develop system solutions to the new technology challenges inherent in assembling and packaging next-generation semiconductor devices. Test interconnect products include a variety of wafer probe cards, ATE interface assemblies, and PC boards for wafer testing, as well as test sockets for all types of packaged semiconductor devices. Kulicke & Soffa's web site address is

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